Atsuko Takita

Evaluation of Creep Deformation by Indentation Test with a Constant Depth - Applicability for Inhomogeneous Materials

In design of the electronic device, FEM analyses considering the creep deformation of solder joints in-situ should be conducted to evaluate the strength reliability. The indentation test is one of effective method to evaluate the creep deformation in microscopic region. However, the result obtained by the indentation test does not coincide with that obtained by the tensile creep test. To solve the problem, the method to determine the suitable area for the indentation test had also been proposed by using the numerical test. To apply the proposed method for the actual indentation test, the homogeneity of specimen should be considered. In this paper, the analyses of the proposed indentation tests were conducted by using the homogeneous and inhomogeneous specimen models of Sn-3.0Ag-0.5Cu. Three types of the deformation behavior were given for the initial phase and the indenter was pushed into in the specimen at the three locations. As a result, it was found that there was not difference in the distribution of the principal stress caused by variation in the indent location. However, the proposed method can successfully determine the reference area except for the case when the deformation behaviors of the constituent phases have a large difference.

Evaluation of the Stress Distribution by the Stepped Load Indentation Test with Constant Depth

For accurate evaluation of the reliability of electronic package, FEM analyses considering the creep deformation of solder joint in-situ should be conducted. It is well known that the indentation creep test has an advantage to evaluate the creep deformation in microscopic region although there are the problems. Authors already modified the indentation creep test and proposed the method to estimate the steady state creep deformation by the modified test. For lead free solders generally used for the solder joint, the transient creep deformation should be measured by the indentation test in addition to the steady state creep deformation. The transient creep strain occurs in the indentation process. Therefore, it needs to separate the strain into the elastic-plastic strain and the creep strain. In this paper, the method to obtain the stress-strain relation using the indentation test is proposed. New indentation test used the stepped load was proposed to obtained the stress variation during the indenter was pushed and conducted by the numerical test. The suitable measurement point to obtain the relationship between the stress and the strain was identified. The stress variation estimated by proposed area well coincides with the equivalent stress variation of the nodal solution. Therefore, if the method to obtain the strain variation during the indentation process by the indentation in future is developped, it may be possible to estimate the stress-strain curve expressed the uniaxial deformation in the microscopic region.

A Method to Evaluate Creep Properties of Solder Alloys Using Micro Indentation

An indentation creep test is one of the effective methods to directly evaluate the creep deformation of solder joint. However, the indentation test does not give the same creep properties as those obtained by the uniaxial creep tests using a bulk specimen. In this paper, the authors proposes an indentation test conducted under the constant depth to determine a suitable reference area, which leads to the same creep characteristics as those obtained by the uniaxial creep test. A series of numerical micro indentation tests under a constant depth were conducted to construct a method to determine a new reference area without creep data obtained from the uniaxial creep test using bulk specimens. The numerical tests were conducted using finite element method (FEM). The numerical tests showed that the distribution of the principal stress plays an important role to determine the reference area of the indentation tests. Finally, it was found that the reference area obtained considering the distribution of the principal stress gives almost the same creep characteristic as those obtained by the uniaxial creep using bulk specimens.