Atsushi Tojyo

CHIP-TYPE ELECTRONIC COMPONENT

Inductor built-in electronic parts using via holes

Method of forming bump electrodes

LC resonant part with a via hole inductor directly connected to the ground electrode

LC filter with external electrodes only on a smaller layer

LC resonating component and method of making same

Multi-layer substrate

Multilayer LC composite component with ground patterns having corresponding extended and open portions

Multilayered LC filter

Electronic surface mount device - has electronic element with exposed flat surface in its upper region for drawing up device with suction nozzle