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Auburger Albert

Infineon Technologies

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Publication

Featured researches published by Auburger Albert.

Archive | 2006

Opto-electronic device, and method of manufacturing

Hurt Hans; Wittl Josef; Weberpals Frank; Schunk Nikolaus; Auburger Albert; Paulus Stefan; Lichtenegger Thomas

Archive | 2003

Elektronisches Sensorbauteil und Verfahren zu seiner Herstellung

Theus Horst; Auburger Albert; Paulus Stefan; Stadler Bernd

Archive | 2003

Electronic component with at least one semiconductor chip and screen for high frequency electromagnetic radiation

Paulus Stefan; Auburger Albert; Theus Horst; Stadler Bernd

Archive | 2001

Device for packaging/transporting electronic parts, has belt-shaped bearer body with through openings for electronic components, and foils applied/removed laterally for inserting/removing parts

Auburger Albert; Paulus Stefan; Winterer Juergen

Archive | 2003

Hochfrequenz-Leistungsbauteil und Hochfrequenz-Leistungsmodul sowie Verfahren zur Herstellung derselben

Theus Horst; Auburger Albert; Klose Frank; Lehner Rudolf

Archive | 2002

Production of an integrated component comprises preparing an integrated circuit with contact pads connected to electrically conducting humps, applying the circuit onto a substrate

Paulus Stefan; Auburger Albert; Hainz Oswald; Lang Dietmar; Petz Martin; Weber Michael

Archive | 2005

MANUFACTURING METHOD FOR SEMICONDUCTOR CONSTITUENT ELEMENT HAVING CONTACT SECTION ON LOWER SIDE

Hainz Oswald; Paulus Stefan; Lehner Rudolf; Auburger Albert; Lang Dietman; Petz Martin; Weber Michael

Archive | 2007

Verfahren zum Herstellen eines mit einem Kunststoffgehäuse versehenen optischen oder elektronischen Moduls das eine optische oder elektronische Komponente enthält, sowie optisches oder elektronisches Modul

Hurt Hans; Wittl Josef; Weberpals Frank; Schunk Nikolaus; Auburger Albert; Paulus Stefan; Prucker Stephan

Archive | 2003

Production of an electronic semiconductor component, comprises placing and joining together insulating layers, applying semiconductor chip to uppermost layer, joining contact surfaces, and encapsulating chip and uppermost layer

Auburger Albert; Theuss Horst; Kilger Thomas

Archive | 2003

Electronic component used for high frequency applications, especially oscillator switches, comprises an induction coil, and a flat plastic housing having an upper side and a lower side

Theus Horst; Auburger Albert; Paulus Stefan; Stadler Bernd

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Collaboration

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Paulus Stefan

Infineon Technologies

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Theus Horst

Infineon Technologies

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Hainz Oswald

Infineon Technologies

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Petz Martin

Infineon Technologies

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Stadler Bernd

Infineon Technologies

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Weber Michael

Infineon Technologies

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Hurt Hans

Infineon Technologies

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Lang Dietmar

Infineon Technologies

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Lehner Rudolf

Infineon Technologies

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Winterer Juergen

Infineon Technologies

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