Avi Tuito

Type II superlattice technology for LWIR detectors

SCD has developed a range of advanced infrared detectors based on III-V semiconductor heterostructures grown on GaSb. The XBn/XBp family of barrier detectors enables diffusion limited dark currents, comparable with MCT Rule-07, and high quantum efficiencies. This work describes some of the technical challenges that were overcome, and the ultimate performance that was finally achieved, for SCD’s new 15 μm pitch “Pelican-D LW” type II superlattice (T2SL) XBp array detector. This detector is the first of SCDs line of high performance two dimensional arrays working in the LWIR spectral range, and was designed with a ~9.3 micron cut-off wavelength and a format of 640 x 512 pixels. It contains InAs/GaSb and InAs/AlSb T2SLs, engineered using k • p modeling of the energy bands and photo-response. The wafers are grown by molecular beam epitaxy and are fabricated into Focal Plane Array (FPA) detectors using standard FPA processes, including wet and dry etching, indium bump hybridization, under-fill, and back-side polishing. The FPA has a quantum efficiency of nearly 50%, and operates at 77 K and F/2.7 with background limited performance. The pixel operability of the FPA is above 99% and it exhibits a stable residual non uniformity (RNU) of better than 0.04% of the dynamic range. The FPA uses a new digital read-out integrated circuit (ROIC), and the complete detector closely follows the interfaces of SCD’s MWIR Pelican-D detector. The Pelican- D LW detector is now in the final stages of qualification and transfer to production, with first prototypes already integrated into new electro-optical systems.

Advanced multi-function infrared detector with on-chip processing

Modern electro-optical systems contain several components such as thermal imager, laser designator, laser range finder, etc. The demand for compact systems with low power consumption and low cost can be addressed by incorporating some of the traditional system abilities into the IR detector. We present SNIR, a new type of detector, which consists of a Read Out Integrated Circuit (ROIC) with advanced on-chip signal processing. The ROIC is flip chip-bonded to a 640x512 InSb detector array of 15μm pitch. SNIR digital ROIC can be operated in either one of the following four different modes of operation. The first operation mode is standard thermal imaging, which has typical functionalities and performance of MWIR detector. The second operation mode is a dual-function mode that includes both standard thermal imaging and information on Asynchronous Laser Pulse Detection (ALPD) for each pixel. The detection probability of a laser pulse is significantly increased by integrating a dedicated in-pixel circuit for identifying a fast signal temporal profile. Since each pixel has internal processing to identify laser pulses, it is possible also to measure the elapsed time between a trigger and the detection of a laser pulse. This yields a third mode of operation in which the detector is synchronized to a laser and becomes a Two-dimensional Laser Range Finder (TLRF). The forth operation mode is dedicated to Low Noise Imaging (LNIM) for the SWIR band, where the IR radiation signal is low. It can be used in both passive or active imaging. We review some of the predicted and measured results for the different modes of operation, both at the detector level and at the system level.

InAs/GaSb Type II superlattice barrier devices with a low dark current and a high-quantum efficiency

InAs/GaSb Type II superlattices (T2SLs) are a promising III-V alternative to HgCdTe (MCT) for infrared Focal Plane Array (FPA) detectors. Over the past few years SCD has developed the modeling, growth, processing and characterization of high performance InAs/GaSb T2SL detector structures suitable for FPA fabrication. Our LWIR structures are based on an XBpp design, analogous to the XBnn design that lead to the recent launch of SCD’s InAsSb HOT MWIR detector (TOP= 150 K). The T2SL XBpp structures have a cut-off wavelength between 9.0 and 10.0 μm and are diffusion limited with a dark current at 78K that is within one order of magnitude of the MCT Rule 07 value. We demonstrate 30 μm pitch 5 × 5 test arrays with 100% operability and with a dark current activation energy that closely matches the bandgap energy measured by photoluminescence at 10 K. From the dependence of the dark current and photocurrent on mesa size we are able to determine the lateral diffusion length and quantum efficiency (QE). The QE agrees very well with the value predicted by our recently developed k · p model [Livneh et al, Phys. Rev. B86, 235311 (2012)]. The model includes a number of innovations that provide a faithful match between measured and predicted InAs/GaSb T2SL bandgaps from MWIR to LWIR, and which also allow us to treat other potential candidate systems such as the gallium free InAs/InAsSb T2SL. We will present a critical comparison of InAs/InAsSb vs. InAs/GaSb T2SLs for LWIR FPA applications.

Large-format 17μm high-end VOx μ-bolometer infrared detector

Long range sights and targeting systems require a combination of high spatial resolution, low temporal NETD, and wide field of view. For practical electro-optical systems it is hard to support these constraints simultaneously. Moreover, achieving these needs with the relatively low-cost Uncooled μ-Bolometer technology is a major challenge in the design and implementation of both the bolometer pixel and the Readout Integrated Circuit (ROIC). In this work we present measured results from a new, large format (1024×768) detector array, with 17μm pitch. This detector meets the demands of a typical armored vehicle sight with its high resolution and large format, together with low NETD of better than 35mK (at F/1, 30Hz). We estimate a Recognition Range for a NATO target of better than 4 km at all relevant atmospheric conditions, which is better than standard 2nd generation scanning array cooled detector. A new design of the detector package enables improved stability of the Non-Uniformity Correction (NUC) to environmental temperature drifts.

SCD's uncooled detectors and video engines for a wide-range of applications

Over the last decade SCD has established a state of the art VOx μ-Bolometer product line. Due to its overall advantages this technology is penetrating a large range of systems. In addition to a large variety of detectors, SCD has also recently introduced modular video engines with an open architecture. In this paper we will describe the versatile applications supported by the products based on 17μm pitch: Low SWaP short range systems, mid range systems based on VGA arrays and high-end systems that will utilize the XGA format. These latter systems have the potential to compete with cooled 2nd Gen scanning LWIR arrays, as will be demonstrated by TRM3 system level calculations.

Large-format 17µm high-end VOx µ-bolometer infrared detector

Long range sights and targeting systems require a combination of high spatial resolution, low temporal NETD, and wide field of view. For practical electro-optical systems it is hard to support these constraints simultaneously. Moreover, achieving these needs with the relatively low-cost Uncooled μ-Bolometer technology is a major challenge in the design and implementation of both the bolometer pixel and the Readout Integrated Circuit (ROIC). In this work we present measured results from a new, large format (1024×768) detector array, with 17μm pitch. This detector meets the demands of a typical armored vehicle sight with its high resolution and large format, together with low NETD of better than 35mK (at F/1, 30Hz). We estimate a Recognition Range for a NATO target of better than 4 km at all relevant atmospheric conditions, which is better than standard 2nd generation scanning array cooled detector. A new design of the detector package enables improved stability of the Non-Uniformity Correction (NUC) to environmental temperature drifts.

Ruggedizing infrared integrated Dewar-detector assemblies for harsh environmental conditions

Cryogenically cooled infrared electro-optical payloads have to operate and survive frequent exposure to harsh vibrational and shock conditions typical of the modern battlefield. This necessitates the development of special approaches to ruggedizing their sensitive components. The ruggedization requirement holds true specifically for Integrated Dewar-Detector Assemblies (IDDA), where the infrared Focal Plane Array (FPA) is usually supported by a thin-walled cold finger enveloped by an evacuated tubular Dewar. Without sufficient ruggedization, harsh environmental vibration may give rise to structural resonance responses resulting in spoiled image quality and even mechanical fractures due to material fatigue. The authors present their approach for the ruggedization of the IDDA by attaching the FPA to a semi-rigid support extending from the dynamically damped Dewar envelope. A mathematical model relies on an experimentally evaluated set of frequency response functions for a reference system and a lumped model of a wideband dynamic absorber. By adding only 2% to the weight of the IDDA, the authors have managed to attenuate the relative deflection and absolute acceleration of the FPA by a factor of 3. The analytical predictions are in full agreement with experiment.

Ruggedizing vibration sensitive components of electro-optical module using wideband dynamic absorber

In the modern design approach, the cold portion of Integrated Dewar-Detector-Cooler-Assembly (substrate, infrared focal plane array, cold shield and cold filter) is directly mounted upon the distal end of a cold finger of a cryogenic cooler with no mechanical contact with the warm Dewar shroud. This concept allows for essential reduction of parasitic (conductive) heat load. The penalty, however, is that resulting tip-mass cantilever is lightly damped and, therefore, prone to vibrational extremes typical of the modern battlefield. Without sufficient ruggedizing, vibration induced structural resonances may affect image quality and even may cause mechanical failures due to material fatigue. Use of additional front supports or thickening the cold finger walls results in increased parasitic conductive heat load, power consumption and mechanical complexity. The authors explore the concept of wideband dynamic absorber in application to ruggedizing the Integrated Dewar-Detector-Cooler Assembly.

Low SWaP SWIR video engine for image intensifier replacement

Night Vision Imaging in the Short-Wave Infra-Red (SWIR) has some unique advantages over Visible, Near Infra-Red (NIR) or thermal imaging. It benefits from relatively high irradiance levels and intuitive reflective imaging. InGaAs/InP is the leading technology for two-dimensional (2D) SWIR detector arrays, utilizing low dark current, high efficiency and excellent uniformity. SCDs SWIR Imager is a low Size, Weight and Power (SWaP) video engine based on a low noise 640x512/15μm InGaAs Focal Plane Array (FPA) embedded in a low cost plastic package which includes a Thermo-Electric Cooler (TEC). The SWIR Imager dimensions are 31x31x32 mm3, it weighs 50 gram and has less than 1.4W Power consumption (excluding TEC). It supports conventional video formats, such as Camera Link and BT.656. The video engine image processing algorithms include Non-Uniformity Correction (NUC), Auto Exposure Control (AEC), Auto Gain Control (AGC), Dynamic Range Compression (DRC) and de-noising algorithms. The algorithms are specifically optimized for Low Light Level (LLL) conditions enabling imaging from sub mlux to 100 Klux light levels. In this work we will review the optimized video engine LLL architecture, electro-optical performance and the applicability to night vision systems.

Attenuation of cryocooler induced vibration using multimodal tuned dynamic absorbers

Modern infrared imagers often rely on split Stirling linear cryocoolers comprising compressor and expander, the relative position of which is governed by the optical design and packaging constraints. A force couple generated by imbalanced reciprocation of moving components inside both compressor and expander result in cryocooler induced vibration comprising angular and translational tonal components manifesting itself in the form of line of sight jitter and dynamic defocusing. Since linear cryocooler is usually driven at a fixed and precisely adjustable frequency, a tuned dynamic absorber is a well suited tool for vibration control. It is traditionally made in the form of lightweight single degree of freedom undamped mechanical resonator, the frequency of which is essentially matched with the driving frequency or vice versa. Unfortunately, the performance of such a traditional approach is limited in terms of simultaneous attenuating translational and angular components of cooler induced vibration. The authors are enhancing the traditional concept and consider multimodal tuned dynamic absorber made in the form of weakly damped mechanical resonator, where the frequencies of useful dynamic modes are essentially matched with the driving frequency. Dynamic analysis and experimental testing show that the dynamic reactions (forces and moments) produced by such a device may simultaneously attenuate both translational and angular components of cryocoolerinduced vibration. The authors are considering different embodiments and their suitability for different packaging concepts. The outcomes of theoretical predictions are supported by full scale experimentation.