B. Meyler

Gain mechanism in GaN Schottky ultraviolet detectors

Schottky barrier GaN ultraviolet detectors, both in vertical and in lateral configuration, as well as in a metal–semiconductor–metal geometry were implemented. All devices exhibit a high gain at both reverse and forward bias. The photoresponse in the forward bias is in the positive current direction. We attribute the gain to trapping of minority carriers at the semiconductor–metal interface. The excellent agreement between the calculated responsivity and the experiment indicates that the model is valid for all device structures under study, and represents a unified description of gain mechanism in GaN Schottky detectors.

Thermal microcrack distribution control in GaN layers on Si substrates by lateral confined epitaxy

GaN epitaxial layers grown uniformly on Si substrates suffer from randomly distributed thermal cracks. The growth on prepatterned Si substrates is demonstrated as an efficient way to control the geometrical distribution of the thermal cracks. In order to study this effect and to find the maximum crack-free lateral dimension of a GaN patterned unit on Si, a simple procedure termed lateral confined epitaxy (LCE) was developed. This procedure confines the growth of GaN to separate mesas of Si, which are defined on the Si substrate prior to the growth. The growth is performed by a single, continuous metalorganic chemical vapor deposition run. LCE enables the variation of mesa lateral size, while keeping the growth rate nearly unchanged. By performing a set of LCE growth runs of ∼0.7 μm GaN, on Si mesas of varying lateral dimensions, we specified the maximum crack-free range of GaN on Si as 14.0±0.3 μm, for that GaN thickness. A reduction of random crack density is observed with decreasing GaN pattern size and...

Dependence of the refractive index of AlxGa1−xN on temperature and composition at elevated temperatures

The refractive index of hexagonal AlxGa1−xN at room temperature and its temperature dependence at elevated temperatures have been determined with high accuracy by spectroscopic ellipsometry. Measurements have been conducted on samples with aluminum molar fractions ranging from 0% to 65% and at temperatures between 290 and 580 K. The refractive index in the transparent spectral region has been determined as a function of photon energy, using the Kramers–Kronig relations with suitable approximations, and applying a multilayer model. An analytical expression for the composition and temperature dependent refractive index in the transparent region, above room temperature, has been obtained. The refractive index has been found to increase with increasing temperature. The shift of the refractive index is strongest for GaN and decreases for AlGaN with increasing aluminum molar fraction. The impact on the properties of GaN based waveguides is illustrated by a slab waveguide calculation.

Triangular nanobeam photonic cavities in single-crystal diamond

Diamond photonics provides an attractive architecture to explore room temperature cavity quantum electrodynamics and to realize scalable multi-qubit computing. Here, we review the present state of diamond photonic technology. The design, fabrication and characterization of a novel nanobeam cavity produced in a single crystal diamond are demonstrated. The present cavity design, based on a triangular cross-section, allows vertical confinement and better signal collection efficiency than that of slab-based nanocavities and eliminates the need for a pre-existing membrane. The nanobeam is fabricated by focused-ion-beam (FIB) patterning. The cavity is characterized by confocal photoluminescence. The modes display quality factors of Q~220 and deviate in wavelength by only ~1.7?nm from the nitrogen-vacancy (NV?) color center zero phonon line (ZPL). The measured results are found to be in good agreement with three-dimensional finite-difference-time-domain (FDTD) calculations. A more advanced cavity design with Q=22?000 is modeled, showing the potential for high-Q implementations using the triangular geometry. The prospects of this concept and its application in spin non-demolition measurement and quantum computing are discussed.

Anisotropy in detectivity of GaN Schottky ultraviolet detectors: Comparing lateral and vertical geometry

Vertical and lateral geometry GaN-based Schottky barrier photodetectors have been implemented, using similar quality material and the same fabrication process. The vertical detector exhibits two orders of magnitude higher responsivity. This is attributed to improved ohmic backcontacts, due to the highly doped buried layer. The vertical detectors exhibits also lower 1/f noise level, which is attributed to the reduced effect of dislocations on the carrier transport, resulting in lower mobility fluctuations. The vertical detector normalized detectivity is four orders of magnitude higher.

The effect of AlN buffer layer on GaN grown on (111)-oriented Si substrates by MOCVD

GaN films were grown by metal organic chemical vapor deposition on (1 1 1)Si substrates, using AlN as a buffer layer. The influence of the AlN buffer layer growth temperature and growth duration on the morphology and preferred orientation of GaN films was studied. Drastic enhancement of epitaxial registration was observed with increasing buffer growth temperature. A sharp transition in the growth mode occurred at 760°C. For that temperature, an optimal buffer layer growth duration was found. The use of March parameter as a figure of merit in X-ray diffraction testing of textured GaN films is proposed.

Characteristics of metal-insulator-semiconductor capacitors based on high-k HfAlO dielectric films obtained by low-temperature electron-beam gun evaporation

We describe the characteristics of thin HfAlO films deposited at low temperature by electron beam gun evaporation. As-deposited films thinner than 6 nm exhibit an effective dielectric constant (keff) of 9–11.5. The minimum quantum mechanical corrected effective oxide thickness is ∼1.45nm and the leakage currents are very low. Rapid thermal annealing in a N2 environment improves the leakage further and up to 750 °C does not affect keff. Higher annealing temperatures reduce keff, but even at 950 °C, it has a value of 6.5. These HfAlO films have the potential to serve as a substitute for SiO2 in small-scale metal-insulator-semiconductor structures.

Lateral confined epitaxy of GaN layers on Si substrates

We developed a novel, simple procedure for achieving lateral confined epitaxy (LCE). This procedure enables the growth of uncracked GaN layers on a Si substrate, using a single, continuous metalorganic chemical vapor deposition (MOCVD) run. The epitaxial growth of GaN is confined to mesas, defined by etching into the Si substrate prior to the growth. The LCE-GaN layers exhibit improved morphological and optical properties compared to the plain GaN-on-Si layers grown in the same MOCVD system. By performing a set of LCE growth runs on mesas of varying lateral dimensions, we specified the crack-free range of GaN on Si as 14.0 ± 0.3 μm.

Characteristics of In/sub x/Al/sub 1-x/N-GaN high-electron mobility field-effect transistor

GaN-based field effect transistors commonly include an Al/sub x/Ga/sub 1-x/N barrier layer for confinement of a two-dimensional electron gas (2DEG) in the barrier/GaN interface. Some of the limitations of the Al/sub x/Ga/sub 1-x/N-GaN heterostructure can be, in principle, avoided by the use of In/sub x/Al/sub 1-x/N as an alternative barrier, which adds flexibility to the engineering of the polarization-induced charges by using tensile or compressive strain through varying the value of x. Here, the implementation and electrical characterization of an In/sub x/Al/sub 1-x/-GaN high electron mobility transistor with Indium content ranging from x=0.04 to x=0.15 is described. The measured 2DEG carrier concentration in the In/sub 0.04/Al/sub 0.96/N-GaN heterostructure reach 4/spl times/10/sup 13/ cm/sup -2/ at room temperature, and Hall mobility is 480 and 750 cm/sup 2//V /spl middot/ s at 300 and 10 K, respectively. The increase of Indium content in the barrier results in a shift of the transistor threshold voltage and of the peak transconductance toward positive gate values, as well as a decrease in the drain current. This is consistent with the reduction in polarization difference between GaN and In/sub x/Al/sub 1-x/N. Devices with a gate length of 0.7 /spl mu/m exhibit f/sub t/ and f/sub max/ values of 13 and 11 GHz, respectively.

Nonvolatile low-voltage memory transistor based on SiO2 tunneling and HfO2 blocking layers with charge storage in Au nanocrystals

We demonstrate a low voltage nonvolatile memory field effect transistor comprising thermal SiO2 tunneling and HfO2 blocking layers as the gate dielectric stack and Au nanocrystals as charge storage nodes. The structure exhibits a memory window of ∼2 V at an applied sweeping voltage of ±3 V which increases to 12.6 at ±12 V. Retention tests show an extrapolated loss of 16% after ten years in the hysteresis width of the threshold voltage. Dynamic program/erase operation reveal an approximately pulse width independent memory for pulse durations of 1 μs to 10 ms; longer pulses increase the memory window while for pulses shorter than 1 μs, the memory windows vanishes. The effective oxide thickness is below 10 nm with very low gate and drain leakage currents.