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Dive into the research topics where Baoling Li is active.

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Featured researches published by Baoling Li.


Powder Metallurgy | 2007

Microstructure and thermal stability of Al–Ti alloys prepared by mechanical milling and reactive sintering

D. Y. Peng; Baoling Li; X. L. Chen; E. Y. Jiang; H. L. Bai; Z. Q. Li; Ping Wu

Abstract The Al–10Ti and Al–64Ti (wt-%) powders were synthesised by mechanical milling. The X-ray diffraction (XRD) and scanning electron microscopy (SEM) results show that aluminium and titanium powders are refined rapidly and mixed uniformly, and finer particles result from the increase in milling time. The average particle size reached 5 μm after 100 h of milling. The structure of a metastable Ti(Al) hexagonal close packed (hcp) supersaturated solid solution was obtained after 140 h of milling. With increasing milling time (t=300 h), an amorphous phase occurred in Al–64Ti powders. Thermodynamic results of various competitive phases in the process were calculated and compared according to the Miedema model, which revealed how these phases proceeded. The milled Al–10Ti and Al–64Ti powders were consolidated by cold pressing (15 MPa) and sintering. The longer the milling time, the more energy stored in the composite powders. Correspondingly, the activation energy of the reaction for Al–Ti intermetallics decreased. The 50 h milled powders produced Al3Ti after heat treatment at 450°C for 5 h. In the case of 110 h milled samples, the final equilibrium phase is AlTi.


Computational Materials Science | 2009

Structural, elastic and electronic properties of intermetallics in the Pt-Sn system: A density functional investigation

Wei Zhou; Lijuan Liu; Baoling Li; Ping Wu; Qinggong Song


Journal of Electronic Materials | 2009

Structural, Elastic, and Electronic Properties of Al-Cu Intermetallics from First-Principles Calculations

Wei Zhou; Lijuan Liu; Baoling Li; Qinggong Song; Ping Wu


Archive | 2008

Symmetrical liquid drop injecting three-dimensional fast shaping method and apparatus thereof

Ping Wu; Wei Zhou; Lijuan Liu; Baoling Li; Hongbo Zhang


Journal of Electronic Materials | 2009

Effect of Intermetallic on Electromigration and Atomic Diffusion in Cu/SnAg3.0Cu0.5/Cu Joints: Experimental and First-Principles Study

Wei Zhou; Lijuan Liu; Baoling Li; Ping Wu


Journal of Alloys and Compounds | 2009

Interfacial reactions between Sn―8Zn―3Bi―xAg lead-free solders and Cu substrate

Lijuan Liu; Wei Zhou; Baoling Li; Ping Wu


Materials Chemistry and Physics | 2010

Interfacial reactions between Sn–8Zn–3Bi–xNi lead-free solders and Cu substrate during isothermal aging

Lijuan Liu; Wei Zhou; Baoling Li; Ping Wu


Microelectronics Reliability | 2010

Electromigration behavior in Cu/Sn―8Zn―3Bi/Cu solder joint

Lijuan Liu; Wei Zhou; Hongbo Zhang; Baoling Li; Ping Wu


Archive | 2008

Method and device for preparing micro-uniform grain using harmonic method

Ping Wu; Lijuan Liu; Wei Zhou; Baoling Li; Yi Wang


Archive | 2010

Method and device for preparing microparticles by splitting liquid drop using electric charge oscillation method

Baoling Li; Ping Wu; Hongbo Zhang; Wei Zhou; Lijuan Liu

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Qinggong Song

Civil Aviation University of China

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