Barbara Lehner

UV-curable adhesive semiconductor chip mounting process

UV-hardenable and thermally hardenable epoxy resins for underfilling electrical and electronic components

One-component epoxy resin for covering electronic components

Tension-free bonding of flat workpiece to substrate - with different coefft. of thermal expansion using cationically hardening resin compsn. which is irradiated then heated to moderate temp.

Coating compounds for electrical and electronic components containing vitreons fused silica

Drop-covering mass for electric and electronic devices

Electro-optical coupler with circuitry and converters, separated from optical fibres by filled coupling gap

Radiation-curable reaction resin system

A cast resin formulation useful for Glop, Top-flip, and/or adhesive applications in electrotechnical and electronic product manufacture

Uv-curable and thermosetting epoxy resin lacquer for electronic subassemblies in humid spaces