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Barbara Lehner

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Publication

Featured researches published by Barbara Lehner.

Archive | 1990

UV-curable adhesive semiconductor chip mounting process

Heiner Bayer; Barbara Lehner; Oskar Wirbser; Gregor Unger

Archive | 1999

UV-hardenable and thermally hardenable epoxy resins for underfilling electrical and electronic components

Barbara Lehner; Recai Sezi

Archive | 1997

One-component epoxy resin for covering electronic components

Heiner Bayer; Barbara Lehner; Ernst Wipfelder

Archive | 1990

Tension-free bonding of flat workpiece to substrate - with different coefft. of thermal expansion using cationically hardening resin compsn. which is irradiated then heated to moderate temp.

Heiner Bayer; Ralf Dr. Criens; Barbara Lehner

Archive | 1992

Coating compounds for electrical and electronic components containing vitreons fused silica

Heiner Bayer; Barbara Lehner; Hans-Peter Fritsch; Kurt Wohak

Archive | 1990

Drop-covering mass for electric and electronic devices

Heiner Bayer; Barbara Lehner; Hans-Peter Fritsch; Kurt Wohak

Archive | 1997

Electro-optical coupler with circuitry and converters, separated from optical fibres by filled coupling gap

Volker Plickert; Ralf Dipl Ing Carl; Barbara Lehner

Archive | 1994

Radiation-curable reaction resin system

Heiner Bayer; Barbara Lehner; Michael Rogalli

Archive | 1998

A cast resin formulation useful for Glop, Top-flip, and/or adhesive applications in electrotechnical and electronic product manufacture

Klaus Hoehn; Barbara Lehner; Ernst Wipfelder

Archive | 2006

Uv-curable and thermosetting epoxy resin lacquer for electronic subassemblies in humid spaces

Grit Stelle; Barbara Lehner; Wolfgang Übler

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Collaboration

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Heiner Bayer

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Recai Sezi

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Ernst Wipfelder

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Oskar Wirbser

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Hans-Peter Fritsch

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Kurt Wohak

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Gregor Unger

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Michael Rogalli

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Klaus Hoehn

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Ralf Dipl Ing Carl

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