Bastian Arndt

A TLP-based Human Metal Model ESD-generator for device qualification according to IEC 61000-4-2

In the last years system-level electrostatic discharges tests according to IEC 61000-4-2 have become widely used for component ESD qualification although it suffers from poor reproducibility. To minimize the disadvantages a so called Human Metal Model (HMM) measurement technique is momentarily in discussion and the standardization committee (SP5.6, ESDA) is working on its definition. The current stress waveform of HMM is identical to the IEC 61000-4-2 one. In this paper a new HMM pulse generator set-up based on a TLP pulse generator will be discussed. To get a deeper insight in the HMM method, discrete components, on-chip ESD test structures as well as a LIN transceiver were evaluated with this technique. The gained measurement results are compared with those resulting out of the IEC tests.

Comparing Cable Discharge Events to IEC 61000-4-2 or ISO 10605 Discharges

Cable Model (CM) discharge events can cause serious ESD damages. Especially during the automotive production process, when numerous cables are connected to electronic devices. Here exists a potential risk for electronic devices. Typical cable discharges occurring in the automotive production environment are investigated and characterized. Possible charging effects of the wiring harness were identified. Discharge shapes depending on automotive wiring harness configurations were classified. Modelling of the cable parameters was done and cable discharge events were simulated. The simulation results were verified with measurements. Possible impacts on affected electronic control units were identified and a comparison between ISO/IEC electrostatic discharges and cable discharges was drawn.

Impact of setup and pulse generator on automotive component ESD testing results

The setup and the pulse generator for automotive component ESD testing are defined in the standard ISO 10605. Usually the DUT is placed directly on a horizontal coupling plane (HCP) or on a dissipative mat and the ESD generator is discharged via the DUT pins applying different charging voltages. The variance of test results in automotive ESD testing is high and one can not be sure if the components are save from ESD failure during lifecycle. Newer grounding concepts and the more frequent use of dielectric housings may affect the testing results further. The influence of setup is analysed in this document considering 3 different cases. ESD failure mechanisms often can be referred to cable discharges with very short rise times. To consider such threats often the transmission line pulser (TLP) is discussed as an alternative testing device. The impact of TLP testing, where cables or wires are discharged, is compared to standard ESD testing devices.

Virtual ESD testing of automotive electronic systems

ESD events can cause numerous destruction effects in automotive electronic circuits. A prediction of ESD stress on system level is difficult and numerous iteration loops in the development process are necessary to fulfill the demands of automotive customers. A concept for system level ESD simulation is presented to predict robustness against ESD. Independent models of the different system components were developed and implemented, in order to build up a simulation process chain focused on ESD protection demands. The simulation method was characterized and compared with real measurements.

Simulation of ESD Thermal Failures and Protection Strategies on System Level

In this paper, approaches for the modeling and simulation of thermal destruction of ICs due to ESD are discussed from a system point of view. Considered systems consist of ESD generator, PCB, protection element, and IC. A direct connection between the ESD generator and the system is always assumed. For the modeling of an IC ESD destruction, the electric behavior model of an IC pin to ground or supply is extended with a thermal destruction model. The thermal model consists mainly of a thermal resistance and a thermal capacitance. When structure temperature reaches a threshold, a failure is assumed. All needed model parameters can be found with a set of measurements and tests. No internal knowledge of the IC or protection element structures is required. The methodology was applied to several ICs, protection elements, and system structures with emphasis on automotive electronics. All needed component model parameters were generated from measurements. Models and parameter measurements are described. Results from the system simulation were compared to system test results with hardware. In most cases, the simulation could predict well the destruction behavior of a system. Thermal failure and safe operating area prediction quality are compared. The described simulation method helps with selection of protection strategies and optimization of system ESD robustness.