Bernd Raabe

Minority charge carrier lifetime mapping of crystalline silicon wafers by time-resolved photoluminescence imaging

A camera-based method to record spatially and time-resolved photoluminescence images of crystalline silicon wafers was developed. The camera signal is modulated by a rotating shutter wheel, allowing for a wide range of camera types to be used for the measurement and easy integration into existing photoluminescence setups. The temporal resolution is sufficient to record the decay curve of photoexcited charge carriers in surface-passivated silicon wafers. A transient measurement of minority carrier lifetimes down to less than 10 μs can be obtained for each pixel individually, without the need for any external calibration.

Minimizing the electrical losses on the front side: Development of a selective emitter process from a single diffusion

In this paper we present latest results in the development of a process for the fabrication of a selective emitter structure on mono- and multicrystalline silicon solar cells. The process is based on an approach that was first introduced by Zerga et al. [1]. We have chosen a wet chemical route for an emitter etch back where the areas of the wafer that are intended for emitter metallization are shielded from etching by a screen printable etch barrier. The etch barrier is later removed by wet chemical etching. The process has yielded a gain in open circuit voltage of more than 1% and a gain in short circuit current of more than 2%. The overall efficiency gain was more than 0.3%abs due to slightly lower fill factor of the cells.

Enabling dielectric rear side passivation for industrial mass production by developing lean printing-based solar cell processes

Al<inf>2</inf>O<inf>3</inf> rear-passivated large-area silicon solar cells with screen-printed metallization are demonstrated for the first time.

The etchback selective emitter technology and its application to multicrystalline silicon

We have developed a simple and industrially applicable selective emitter cell process using only one diffusion step and an emitter etchback to create the high sheet resistance emitter [1, 2]. The process generates a deeper doping profile with a lower surface phosphorous concentration than a directly diffused emitter with the same sheet resistance. This results in an extremely low emitter saturation current j0E even at a moderate sheet resistance of 60–80 Ω/□. The highest independently confirmed cell efficiency on Cz-Si (146 cm2 was 18.7%. In this work the etching behavior of the acidic solution at the grain boundaries is studied by SEM imaging and high resolution LBIC measurements at 405 nm wavelength. The etchback also leads to a change in reflectivity, which is quantified by reflectance measurements. We furthermore investigate the influence of the base material quality on the gain that can be achieved by this process. Large area solar cells have been processed from solar grade and UMG mc silicon.