Bertrand Viala

Andrückkonzept für ein Substrat eines Leistungsmoduls und Leistungsmodul

Electromechanical switching device

Semiconductor based switching device

Semiconductor switching module optimized for resistance to short circuits

The power semiconductor module

High performance semiconductor module

Leistungshalbleitermodul Power semiconductor module

Semiconductor module with improved short circuit resistance

Direct copper bonding substrate and base plate pressing on device for use in power module area, has press-on unit for transmission of pressing force on direct copper bonding substrate, where plastic part is designed as press-on unit

Andrückkonzept für ein Substrat eines Leistungsmoduls und Leistungsmodul Andrückkonzept for a substrate of a power module and the power module