Boen Houng

Tin doped indium oxide transparent conducting thin films containing silver nanoparticles by sol-gel technique

Tin doped indium oxide films (ITO) with embedded silver nanoparticles were prepared by a sol-gel spin coating method. Delafossite structure of tin doped AgInO2 was found at lower annealing temperatures in all compositions and decomposed into ITO and Ag as annealing temperatures were increased. The interconnected network of Ag phases provides effective conducting paths that reduced the electrical resistivity of the films to 8.2×10−5Ωcm. The optical transmissions of the films are greater than 80% in visible wavelength and show an absorption band towards longer wavelength at higher Ag concentrations.

Reliability Design and Optimization Process on Through Mold Via Using Ultrafast Laser

In this study, a through mold via (TMV) process using ultrafast Laser has been developed for the interconnection on 3D package-on-package (PoP) application. Epoxy molding compound (EMC) is a composite material consisted of epoxy resin, filler particles (fused silica) and other constituents. Among these chemical compositions, the size and spatial distribution of fillers on the EMC dominate the sidewall quality on drilled trench. However, random filler leakage on the sidewall leads to an irregular and uneven trench and these drop out fillers become a problem needed to be solved. Faster removal of debris can be achieved by controlling the laser drilling parameters. Parametric studies have been performed to determine the specification of trench and design rule of material. The optimal desmear process on TMV bottom PoP package developed in this study demonstrates the reliability improvement on follow-up sputtering or filling process.