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Dive into the research topics where Boriana Tzaneva is active.

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Featured researches published by Boriana Tzaneva.


Corrosion Engineering Science and Technology | 2014

Effect of phosphoric acid concentration on corrosion of Cr–Mn–N and Cr–Ni stainless steels

Boriana Tzaneva; M. H. Loukaycheva; L. B. Fachikov

Abstract Phosphoric acid concentration (5–85%) effects on the corrosion behaviour of austenitic Fe–18Cr–12Mn–N steel have been studied by potentiodynamic polarisation measurements. After the anodic polarisation, both the film composition and the electronic structure have been investigated by X-ray photoelectron spectroscopy. The specimen surface examinations have been carried out by scanning electron microscopy. The results of the corrosion behaviour of the steel at issue have been compared to those relevant to two trademark materials [austenitic stainless steels AISI 304 (Fe–18Cr–9Ni) and X14AΓ15 (Fe–14Cr–15Mn–N)] and developed under the same test conditions.


2016 XXV International Scientific Conference Electronics (ET) | 2016

Effect of anodization conditions on the breakdown voltage of nanoporous aluminium oxide

Stefan Nenov; Boriana Tzaneva; Svetozar Andreev; Alexander Zahariev; Valentin Videkov

Within the work presented the effect of voltage, electrolyte nature and time of anodization on breakdown voltage of nanoporous aluminium oxide layers are investigated. The dielectric layers formed under various conditions feature a pore diameter from 20 to 90nm, and the thickness lies within 1÷14μm. The results reveal that reanodization up to 300V significantly enhances the breakdown voltage. For Al/Al2O3 structure, it is found out that breakdown voltage depends mainly on the layer thickness and significantly less on the pore diameter.


Scientific Reports | 2018

Engineering of III-Nitride Semiconductors on Low Temperature Co-fired Ceramics

José M. Mánuel; Juan J. Jiménez; F. M. Morales; Bertrand Lacroix; A.J. Santos; R. García; E. Blanco; M. Domínguez; María J. Ramírez; A.M. Beltrán; Dimiter Alexandrov; Jonny Tot; Robert Dubreuil; Valentin Videkov; Svetozar Andreev; Boriana Tzaneva; Heike Bartsch; J. Breiling; J. Pezoldt; M. Fischer; Jens Müller

This work presents results in the field of advanced substrate solutions in order to achieve high crystalline quality group-III nitrides based heterostructures for high frequency and power devices or for sensor applications. With that objective, Low Temperature Co-fired Ceramics has been used, as a non-crystalline substrate. Structures like these have never been developed before, and for economic reasons will represent a groundbreaking material in these fields of Electronic. In this sense, the report presents the characterization through various techniques of three series of specimens where GaN was deposited on this ceramic composite, using different buffer layers, and a singular metal-organic chemical vapor deposition related technique for low temperature deposition. Other single crystalline ceramic-based templates were also utilized as substrate materials, for comparison purposes.


international spring seminar on electronics technology | 2017

Investigation of the efficiency of the heat dissipation for the heat-conducting circuit boards made of aluminum with the nanoporous alumina layer

Svetlozar Andreev; Katsiaryna Chemyakova; Boriana Tzaneva; Valentin Videkov; Igor Vrublevsky

The results of the investigation of the efficiency of the heat dissipation from the circuit board made of aluminum with the nanoporous alumina layer and conducting copper layer. In the construction of these circuit boards nanoporous alumina was used as insulator, which provided heat transfer from topology elements to the aluminum substrate. The conducting copper layer was formed by electroplating followed by chemical deposition of thin nickel layer. The diode MBRB16H60 was used as an element possessing high level of heat release. The temperature on the surface of the circuit board was measured by the thermocouple and the infrared images of the samples were studied by the thermal imaging camera. It was shown that proposed circuit boards allow significantly increasing the efficiency of the heat dissipation from the circuit board elements and reducing their operating temperature. The thermal conductivity of the nanoporous anodic alumina layer was determined to be 1.56 W K−1 m−1.


2017 XXVI International Scientific Conference Electronics (ET) | 2017

Study of thermal conductivity of nanoporous anodic alumina layer formed in sulphuric acid using steady-state heat flow technique

Svetozar Andreev; Katsiaryna Chernyakova; Boriana Tzaneva; Valentin Videkov; Igor Vrublevsky

The paper presents the results of studies of thermal characteristics of nanoporous anodic alumina layer formed in sulphuric acid. One-sided heating of aluminum boards by heating element from carbon filament was used. The temperature of the back side of the board was kept constant by using an aluminum heatsink. Thermograms of aluminum board surface were taken by thermal imaging camera MobIR M4.


2017 XXVI International Scientific Conference Electronics (ET) | 2017

Kinetics of reanodization of porous anodic oxide films on aluminium formed in pore-forming solutions of various acids

Alexander Zahariev; Boriana Tzaneva; Christian Girginov; Svetozar Andreev

Investigations are carried out towards reanodization of porous anodic oxide films on aluminium formed in aqueous solutions of sulphuric, oxalic and chromic acid. These films are prepared in a way to have one and the same porosity. It is found out that in case of equal porosity the slopes of the kinetic voltage-time curves recorded during reanodization are different. The effect of the anionic species incorporated from electrolyte solution into the porous template could be a probable explanation for the dissimilar rates of barrier layer growth.


2014 12th International Conference on Actual Problems of Electronics Instrument Engineering (APEIE) | 2014

Fabrication of microcuvettes using anodic aluminum oxide membrane

Boriana Tzaneva; Valentin Videkov

A variant for preparing an anodic aluminium oxide (AAO) membrane in copper ring with deposited tin last layer is proposed in the work. It allows to create closed microholders (microcuvettes) with developed nanostructured surface by soldering. Classical techniques as photolithography, electrochemical oxidation and metal deposition, etching and soldering was used. Is it approved by FTIR-analysis, that the prepared by proposed technological scheme cuvettes can be used as closed volumes containing gas and volatile liquids with designation of optical sensors.


Chemical Engineering and Processing | 2013

Silver recovery from spent photographic solutions by a magnetically assisted particle bed

Tanya M. Petrova; Boriana Tzaneva; Ludmil Fachikov; Jordan Hristov


Corrosion Engineering Science and Technology | 2015

Effect of chloride ions on corrosion behaviour of austenitic nickel and nickel free stainless steels in phosphoric acid solutions

Boriana Tzaneva; M. H. Loukaycheva; L. B. Fachikov; L. Ts. Jekova


2018 IX National Conference with International Participation (ELECTRONICA) | 2018

Contact Electrode Based on Nanowire Arrays on Conductive Substrate

Tobiya Slavov Karagyozov; Boriana Tzaneva; Valentin Videkov

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Valentin Videkov

Technical University of Sofia

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Svetozar Andreev

Technical University of Sofia

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Alexander Zahariev

Technical University of Sofia

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M. H. Loukaycheva

Technical University of Sofia

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