Brian Simpson
Georgia Institute of Technology
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Publication
Featured researches published by Brian Simpson.
Journal of Materials Chemistry | 2010
Brian Simpson; Grady A. Nunnery; Rina Tannenbaum; Kyriaki Kalaitzidou
Strain engineering was used to make polymer particles that are able to reversibly alter their geometry from three dimensional tubes to two dimensional layers and consequently alter their properties upon changes in temperature. A bilayer of two dissimilar materials, one being a polymer, was deposited on a sacrificial substrate and polymer tubes were formed due to the release of the interfacial residual stress upon removal of the sacrificial substrate. The bilayer consisted of a polydimethysiloxane (PDMS) film with a thickness of several microns coated with a nanometer-thick gold (Au) film. Alternatively, SiC was used instead of Au to demonstrate that the fabrication method can be applied using any two dissimilar materials. The diameter and length of the resulting polymer tubes can be tuned through the thickness of the bilayer and the processing conditions used. The modulus and geometric characteristics of these polymer particles were also determined. Finally, the ability of using these polymer particles as delivery vesicles was demonstrated through selective capture and controllable release of a fluorescently-labelled polymer such as poly(ethylene glycol), which was adsorbed only on the Au and not the PDMS surface of the polymer particles.
Volume 8: 14th Design for Manufacturing and the Life Cycle Conference; 6th Symposium on International Design and Design Education; 21st International Conference on Design Theory and Methodology, Parts A and B | 2009
Brian Simpson; Dirk Schaefer
There is a growing interest in the development of new design methods that will allow companies to adapt to a world that is becoming more competitive due to globalization and a rapidly changing global economic landscape. Several new techniques are being developed as a result of this interest that addresses the unique characteristics of product evolution. For example, Otto and Wood presented a new reverse engineering and redesign methodology that focuses on the process steps needed to understand and represent a current product with the combination of various techniques to address the different stages of the design process [1]. In this paper, we present a case study involving the use of augmentation tools such as affinity diagrams and quality function deployment’s (QDF) house of quality to augment the systematic design approach originally developed by Pahl and Beitz (P&B) [3] and apply it to an existing process and design issue. While presenting their approach, we apply our augmented approach to a laboratory-scaled fabrication process for the creation of adaptive polymer particles. We demonstrate that this augmented design approach could create a large-scale fabrication method that is low in cost, high in quality, and provides greater efficiency than the original method. According to our results, the process time was reduced by as much as 35.4% which would save thousands of dollars each year. In addition, the quality of the fabricated polymeric samples was improved significantly due to the use of advanced tools and simulation techniques. This augmented P&B method will provide an additional option for businesses and engineering designers to consider when faced with the challenges of sustaining designs and design processes.Copyright
Bulletin of the American Physical Society | 2014
Vincent Kim; Brian Simpson; Andrew Seredinski; Eric Schwen; Dan Mazilu; Irina Mazilu
Bulletin of the American Physical Society | 2014
Brian Simpson; Mohammad Abudayyeh; Ali; Alena Hamrick; Dan Mazilu; Irina Mazilu
Bulletin of the American Physical Society | 2014
Eric Schwen; Vincent Kim; Brian Simpson; Jonathan Cook; Irina Mazilu; Dan Mazilu
Bulletin of the American Physical Society | 2014
William Banks; Eric Schwen; Andrew Seredinski; Brian Simpson; Vincent Kim; Conan Zhao
Bulletin of the American Physical Society | 2014
Conan Zhao; Eric Schwen; Andrew Seredinski; Vincent Kim; Brian Simpson; William Banks; Jonathan Cook; Dan Mazilu; Irina Mazilu
Bulletin of the American Physical Society | 2013
Vincent Kim; Will Banks; Andrew Seredinski; Brian Simpson; Dan Mazilu; Irina Mazilu
Bulletin of the American Physical Society | 2013
Katy Wilson; Brian Simpson; Vincent Kim; Andrew Seredinski; Will Banks; Dan Mazilu; Irina Mazilu
Bulletin of the American Physical Society | 2013
Andrew Seredinski; Vincent Kim; Brian Simpson; William Banks; Irina Mazilu; Dan Mazilu