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Brian Taggart

Intel

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Publication

Featured researches published by Brian Taggart.

Archive | 2004

Folded substrate with interposer package for integrated circuit devices

Robert Nickerson; Ronald L. Spreitzer; John C. Conner; Brian Taggart

Archive | 2004

Power distribution within a folded flex package method and apparatus

Brian Taggart; Robert Nickerson; Ronald L. Spreitzer

Archive | 2004

Flip-chips on flex substrates, flip-chip and wire-bonded chip stacks, and methods of assembling same

Brian Taggart; Robert Nickerson; Ronald L. Spreitzer

Archive | 2005

Microelectronic package having a stiffening element and method of making same

Saeed S. Shojaie; Brian Taggart; Dale Hackitt

Archive | 2003

Method and apparatus for trace shielding and routing on a substrate

John C. Conner; Brian Taggart; Robert Nickerson

Archive | 2004

Circular wire-bond pad, package made therewith, and method of assembling same

Robert Nickerson; Brian Taggart; Hai Ding

Archive | 2006

Packaging logic and memory integrated circuits

Robert Nickerson; Brian Taggart; Ronald I. Spreitzer

Archive | 2004

Bottom heat spreader

Dale Hackitt; Robert Nickerson; Brian Taggart

Archive | 2003

Bond finger on via substrate, process of making same, package made thereby, and method of assembling same

Brian Taggart; Ronald L. Spreitzer; Robert Nickerson

Archive | 2004

Lower profile flexible substrate package for electronic components

Brian Taggart; Robert Nickerson; Ronald I. Spreitzer

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Collaboration

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Robert Nickerson

Intel

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Ronald L. Spreitzer

Intel

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Dale Hackitt

Intel

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John C. Conner

Intel

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Hai Ding

Intel

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Saeed S. Shojaie

Intel

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