Brian W. Huber

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international convention on information and communication technology electronics and microelectronics | 2017

Gagan Aggarwal; Daniel Henke; Rajyalakshmi Anantatmukala; Seiichi Takedai; Brian W. Huber

Copper voids are critical defect issues in the metal lines. Massive voids cause functional fails and the smaller ones that do not cause any function fails carry high risk of failing later in life. They are threats to product lifetimes. In this work, we discuss a process for dual damascene copper for metal lines capable of causing surface voids.

advanced semiconductor manufacturing conference | 2017

Gagan Aggarwal; Daniel Henke; Seiichi Takedai; Rajyalakshmi Anantatmukala; Brian W. Huber

Copper voids are critical defect issues in the metal lines. Massive voids cause functional fails and the smaller ones that do not cause any function fails carry high risk of failing later in life. They are threats to product lifetimes. In this work, we discuss a process for dual damascene copper for metal lines capable of causing surface voids.

Archive | 2012