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Dive into the research topics where Bruce A. Cook is active.

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Featured researches published by Bruce A. Cook.


Applied Physics Letters | 2003

Superhard self-lubricating AlMgB14 films for microelectromechanical devices

Y. Tian; Ashraf F. Bastawros; C. C. H. Lo; Alan P. Constant; Alan M. Russell; Bruce A. Cook

Performance and reliability of microelectromechanical system (MEMS) components can be enhanced dramatically through the incorporation of protective thin-film coatings. Current-generation MEMS devices prepared by the lithographie-galvanoformung-abformung (LIGA) technique employ transition metals such as Ni, Cu, Fe, or alloys thereof, and hence lack stability in oxidizing, corrosive, and/or high-temperature environments. Fabrication of a superhard self-lubricating coating based on a ternary boride compound AlMgB14 described in this letter has great potential in protective coating technology for LIGA microdevices. Nanoindentation tests show that the hardness of AlMgB14 films prepared by pulsed laser deposition ranges from 45 GPa to 51 GPa, when deposited at room temperature and 573 K, respectively. Extremely low friction coefficients of 0.04–0.05, which are thought to result from a self-lubricating effect, have also been confirmed by nanoscratch tests on the AlMgB14 films. Transmission electron microscopy st...


Applied Physics Letters | 2004

Electrical transport in amorphous semiconducting AlMgB14 films

Y. Tian; Gang Li; J. Shinar; N. L. Wang; Bruce A. Cook; James W. Anderegg; Alan P. Constant; Alan M. Russell; John Evan Snyder

The electrical transport properties of semiconducting AlMgB14 films deposited at room temperature and 573K are reported in this letter. The as-deposited films are amorphous, and they exhibit high n-type electrical conductivity, which is believed to stem from the conduction electrons donated by Al, Mg, and/or Fe impurities in these films. The film deposited at 573K is less conductive than the room-temperature-deposited film. This is attributed to the nature of donor or trap states in the band gap related to the different deposition temperatures.


Journal of Electronic Materials | 2002

Microstructural modifications and properties of Sn-Ag-Cu solder joints induced by alloying

I.E. Anderson; Bruce A. Cook; J. L. Harringa; R. L. Terpstra


Journal of Electronic Materials | 2003

Isothermal aging of near-eutectic Sn-Ag-Cu solder alloys and its effect on electrical resistivity

Bruce A. Cook; I.E. Anderson; J. L. Harringa; Sung Kwon Kang


Materials Transactions | 2002

Lead-Free Electronics Packaging. Effects of Alloying in Near-Eutectic Tin-Silver-Copper Solder Joints.

Iver E. Anderson; Bruce A. Cook; Joel L. Harringa; Robert L. Terpstra; James C. Foley; Ozer Unal


Archive | 2003

A1mgb14 based cermet with ductile co-mn binder phase

Bruce A. Cook; Alan M. Russell; Joel L. Harringa


Materials Transactions Jim | 2002

Effects of alloying in near-eutectic tin-silver-copper solder joints : Lead-free electronics packaging

Iver E. Anderson; Bruce A. Cook; Joel L. Harringa; Robert L. Terpstra; James C. Foley; Ozer Unal


Archive | 2013

Hard and Super-hard Metal Alloys and Methods for Making the Same

I.E. Anderson; Bruce A. Cook; Joel Harringa; Adam Boesenberg; Joel Rieken; Dave Byrd


Thin Solid Films | 2011

Formation, densification, and selected mechanical properties of hot pressed Al 4SiC 4, Al 4SiC 4 wit

Osama Gaballa; Bruce A. Cook; Alan M. Russell


Archive | 2005

The ductile binder phase, a cobalt-manganese alloy, is used in appropriate quantities to tailor good hardness and reasonable fracture toughness for hard materials so they can be used suitably in industrial machining and grinding applications

Bruce A. Cook; Alan M. Russell; Joel L. Harringa

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I.E. Anderson

United States Department of Energy

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J. L. Harringa

United States Department of Energy

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Y. Tian

Iowa State University

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