Network


Latest external collaboration on country level. Dive into details by clicking on the dots.

Hotspot


Dive into the research topics where Bruce W. Weiss is active.

Publication


Featured researches published by Bruce W. Weiss.


ieee industry applications society annual meeting | 2006

Junction Temperature Prediction of a Multiple-chip IGBT Module under DC Condition

Lixiang Wei; Russ J. Kerkman; Richard A. Lukaszewski; Brian P. Brown; Neil Gollhardt; Bruce W. Weiss

This paper develops a thermal model for a six-pack insulated gate bipolar transistor (IGBT) power module operating as a three phase voltage source inverter. With this model, the temperature of each chip can be derived directly from the losses of the silicon chips and a thermal impedance matrix. The losses of each chip can be calculated through the voltage and current information of the power module. The impedance model can be easily transferred into a micro-processor to predict the online chip temperatures. It largely increases the temperature accuracy when the inverter operates at zero or low output frequency. Theory analysis, simulation and experimental results are provided to verify the effectiveness of this model


intersociety conference on thermal and thermomechanical phenomena in electronic systems | 2012

Driving energy efficiency with design optimization of a centrifugal fan housing system for variable frequency drives

Garron K. Morris; Bruce W. Weiss

Increasing demands for electrical equipment efficiency has renewed interest in improving the electrical and thermal efficiency of industrial equipment. Variable speed drives are typically air-cooled and fall under recent international standards for improved fan efficiency. This paper details the modeling, design optimization, and experimental verification approaches used to optimize blower housing designs for variable speed drives. The design of the blower housing is just as important as the blower selection. By modifying the housing dimensions, the shape and quantity of flow exiting the housing can be controlled. First, the impeller and inlet ring geometry was directly imported into Icepak from a CAD model provided by the manufacturer. Moving Reference Frame and multi-level meshing techniques were used to provide an accurate representation of the air flow. Next, a flow-pressure curve was created by varying the outlet pressure. The blower performance curve was found to follow, but consistently under-predict the empirical fan curve data given by the manufacturer. Using fan laws and a multi-objective optimization approach, a model fan speed that was 2.4% higher than the operating speed was found to make the predicted and manufacturer performance data agree with less than a 3% error. Next, a parametric model of the blower housing was created in Icepak using the tuned blower model. Four parametric variables included the distance from the impeller to the front, bottom, side, and back of the housing was chosen. A fifth variable, pressure was chosen so that the effect of outlet pressure on flow could be extracted. The blower housing was optimized using a Design of Experiments (DoE) technique where the geometry of housing was varied in a structured manner to capture expected second order behavior. The 27-run DoE was performed in Icepak and the volumetric flow through discretized portions of the outlet were recorded. The DoE data for each section of the outlet were fit to equations using a backward regression technique. A genetic algorithm-based optimization technique was used to create housing designs for two different variable frequency drives. Prototypes of the housings were constructed for each design and flow-pressure curves for three samples of each design were measured on a flow bench. The measured curves were found to agree with the predicted blower performance in each housing design to within 7%. Design curves that could be used for other housings were also generated.


Archive | 2008

Junction temperature prediction method and apparatus for use in a power conversion module

Russel J. Kerkman; Lixiang Wei; Richard A. Lukaszewski; Brian P. Brown; Neil Gollhardt; Bruce W. Weiss


Archive | 2012

HEAT SINK COOLING ARRANGEMENT FOR MULTIPLE POWER ELECTRONIC CIRCUITS

Bruce W. Weiss


Archive | 2007

Phase change cooled electrical bus structure

Neil Golhardt; Scott D. Day; Richard A. Lukaszewski; Lawrence D. Radosevich; Bruce W. Weiss


Archive | 2008

Power module life estimation fatigue function

Bruce W. Weiss; Lixiang Wei


Archive | 2007

Phase change cooled power electronic module

Bruce W. Weiss; Neil Gollhardt; Abdolmehdi Kaveh Ahangar; Daniel G. Kannenberg; Steven C. Kaishian


Archive | 2003

Twist out sealed conduit knockout

Bruce W. Weiss; Keith A. Alwardt


Archive | 2015

DC PRE-CHARGE CIRCUIT

Bruce W. Weiss; Doyle F. Busse; Jeremy J. Keegan; Lixiang Wei; Michael Loth; Rangarajan M. Tallam; Yogesh Patel


Archive | 2012

AC pre-charge circuit

Bruce W. Weiss; Doyle F. Busse; Jeremy J. Keegan; Lixiang Wei; Michael Loth; Rangarajan M. Tallam; Yogesh Patel

Collaboration


Dive into the Bruce W. Weiss's collaboration.

Top Co-Authors

Avatar
Top Co-Authors

Avatar
Top Co-Authors

Avatar
Top Co-Authors

Avatar
Top Co-Authors

Avatar
Top Co-Authors

Avatar
Top Co-Authors

Avatar
Top Co-Authors

Avatar
Top Co-Authors

Avatar
Top Co-Authors

Avatar
Researchain Logo
Decentralizing Knowledge