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Dive into the research topics where Buu Q. Diep is active.

Publication


Featured researches published by Buu Q. Diep.


Archive | 2014

Reducing Formation Of Oxide On Solder

Buu Q. Diep; Thomas A. Kocian; Roland W. Gooch


Archive | 2015

Wafer level package solder barrier used as vacuum getter

Roland W. Gooch; Buu Q. Diep; Adam M. Kennedy; Stephen H. Black; Thomas A. Kocian


Archive | 2016

HERMETICALLY SEALED PACKAGE HAVING STRESS REDUCING LAYER

Adam M. Kennedy; Buu Q. Diep; Stephen H. Black; Tse E. Wong; Thomas A. Kocian; Gregory D. Tracy


Archive | 2012

Method of stress relief in anti-reflective coated cap wafers for wafer level packaged infrared focal plane arrays

Roland W. Gooch; Buu Q. Diep; Stephen H. Black; Thomas A. Kocian; Adam M. Kennedy


Archive | 2012

Protecting An Optical Surface

Stephen H. Black; Thomas A. Kocian; Buu Q. Diep


Archive | 2014

Wafer level packaged infrared (IR) focal plane array (FPA) with evanescent wave coupling

Roland W. Gooch; Stephen H. Black; Thomas A. Kocian; Adam M. Kennedy; Buu Q. Diep


Archive | 2017

METHOD OF STRESS RELIEF IN CAP WAFER TO BE ANTI-REFLECTIVELY COATED FOR INFRARED FOCAL PLANE ARRAY TO BE WAFER LEVEL PACKAGED

Roland W. Gooch; Buu Q. Diep; Stephen H. Black; Thomas A. Kocian; Adam M. Kennedy


Archive | 2016

WAFER LEVEL MEMS PACKAGE INCLUDING DUAL SEAL RING

Buu Q. Diep; Adam M. Kennedy; Thomas A. Kocian; Mark Lamb


Archive | 2016

GROUPE DE MEMS AU NIVEAU DE LA PLAQUETTE INCLUANT UNE DOUBLE BAGUE D’ÉTANCHÉITÉ

Buu Q. Diep; Adam M. Kennedy; Thomas A. Kocian; Mark Lamb


Archive | 2014

Als vakuumgetter verwendete lötmittelbarriere für eine verkapselung auf waferebene

Roland W. Gooch; Buu Q. Diep; Adam M. Kennedy; Stephen H. Black; Thomas A. Kocian

Collaboration


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