C. L. Yang

EIT-based fabric pressure sensing

This paper presents EIT-based fabric sensors that aim to provide a pressure mapping using the current carrying and voltage sensing electrodes attached to the boundary of the fabric patch. Pressure-induced shape change over the sensor area makes a change in the conductivity distribution which can be conveyed to the change of boundary current-voltage data. This boundary data is obtained through electrode measurements in EIT system. The corresponding inverse problem is to reconstruct the pressure and deformation map from the relationship between the applied current and the measured voltage on the fabric boundary. Taking advantage of EIT in providing dynamical images of conductivity changes due to pressure induced shape change, the pressure map can be estimated. In this paper, the EIT-based fabric sensor was presented for circular and rectangular sensor geometry. A stretch sensitive fabric was used in circular sensor with 16 electrodes and a pressure sensitive fabric was used in a rectangular sensor with 32 electrodes. A preliminary human test was carried out with the rectangular sensor for foot pressure mapping showing promising results.

Complex conductivity reconstruction in multiple frequency electrical impedance tomography for fabric based pressure

Purpose – The aim of this paper is to introduce and to evaluate the performance of a multiple frequency complex impedance reconstruction for fabric-based EIT pressure sensor. Pressure mapping is an important and challenging area of modern sensing technology. It has many applications in areas such as artificial skins in Robotics and pressure monitoring on soft tissue in biomechanics. Fabric-based sensors are being developed in conjunction with electrical impedance tomography (EIT) for pressure mapping imaging. This is potentially a very cost-effective pressure mapping imaging solution in particular for imaging large areas. Fabric-based EIT pressure sensors aim to provide a pressure mapping image using current carrying and voltage sensing electrodes attached on the boundary of the fabric patch. Design/methodology/approach – Recently, promising results are being achieved in conductivity imaging for these sensors. However, the fabric structure presents capacitive behaviour that could also be exploited for pre...

Reducing computational costs in large scale 3D EIT by using a sparse Jacobian matrix with block-wise CGLS reconstruction

Electrical impedance tomography (EIT) is a fast and cost-effective technique to provide a tomographic conductivity image of a subject from boundary current-voltage data. This paper proposes a time and memory efficient method for solving a large scale 3D EIT inverse problem using a parallel conjugate gradient (CG) algorithm. The 3D EIT system with a large number of measurement data can produce a large size of Jacobian matrix; this could cause difficulties in computer storage and the inversion process. One of challenges in 3D EIT is to decrease the reconstruction time and memory usage, at the same time retaining the image quality. Firstly, a sparse matrix reduction technique is proposed using thresholding to set very small values of the Jacobian matrix to zero. By adjusting the Jacobian matrix into a sparse format, the element with zeros would be eliminated, which results in a saving of memory requirement. Secondly, a block-wise CG method for parallel reconstruction has been developed. The proposed method has been tested using simulated data as well as experimental test samples. Sparse Jacobian with a block-wise CG enables the large scale EIT problem to be solved efficiently. Image quality measures are presented to quantify the effect of sparse matrix reduction in reconstruction results.

Three- dimensional industrial process tomography using electrical and electromagnetic tomography: recent developments

Electrical and Electromagnetic imaging are widely used in many application areas. Most works are done in 2D imaging mode. Recently, volumetric (3D) imaging of passive electromagnetic properties using low frequency electrical and electromagnetic imaging is being developed. This paper presents the latest results of 3D electrical and electromagnetic tomography imaging. The results of experimental data will be presented based on most commonly used finite element modelling of the forward model and the standard Tikhonov regularized inverse solution. Challenges and opportunities will be discussed in presentation.