Caitlin A. Chapin

Multilayer etch masks for 3-dimensional fabrication of robust silicon carbide microstructures

This paper details the creation of 3-dimensional (3-D) microstructures in 4H-silicon carbide (4H-SiC) substrates with a plasma etch process that utilizes multilayer etch masks. An inductively coupled plasma (ICP) etch process (SF6/O2) for SiC was developed and etch rates as high as ~1 μm/min, a selectivity of 60:1 (SiC to Ni), and aspect ratio dependent etch characteristics were demonstrated. In addition, the selectivity of atomic layer deposited (ALD) Al2O3 etch masks to 4H-SiC is reported for the first time. Using this unique process, the microfabrication of complex microstructures (mechanical gears, Lego®-like bricks, and poker chips) is presented. The use of 4H-SiC as the structural material enables such microstructures to be utilized under high cycles of wear, within elevated temperatures, and within chemically corrosive environments.

Characterization of gallium nitride microsystems within radiation and high-temperature environments

New milestones in space exploration can be realized through the development of radiation-hardened, temperature-tolerant materials, sensors and electronics. This enables lightweight systems (reduced packaging requirements) with increased operation lifetimes. Gallium nitride (GaN) is a ceramic, semiconductor material that is stable within high-radiation, high-temperature and chemically corrosive environments. Recently, this material platform has been utilized to realize sensors and electronics for operation under extreme harsh conditions. These devices exploit the two-dimensional electron gas (2DEG) formed at the interface between AlGaN/GaN heterostructures, which is used as the material platform in high electron mobility transistors (HEMTs). In this paper, a review of the advancements in GaN manufacturing technology such as the growth of epitaxially deposited thin films, micromachining techniques and high-temperature metallization is presented. In addition, the compelling results of fabricating and operating micro-scale GaNbased sensors within radiation environments and at elevated temperatures are shown. The paper will close with future directions GaN-based microsystems technology for down-hole, propulsion and space exploration applications.

Thickness engineering of atomic layer deposited Al2O3 films to suppress interfacial reaction and diffusion of Ni/Au gate metal in AlGaN/GaN HEMTs up to 600 °C in air

In this paper, we describe the use of 50 nm atomic layer deposited (ALD) Al2O3 to suppress the interfacial reaction and inter-diffusion between the gate metal and semiconductor interface, to extend the operation limit up to 600 °C in air. Suppression of diffusion is verified through Auger electron spectroscopy (AES) depth profiling and X-ray diffraction (XRD) and is further supported with electrical characterization. An ALD Al2O3 thin film (10 nm and 50 nm), which functions as a dielectric layer, was inserted between the gate metal (Ni/Au) and heterostructure-based semiconductor material (AlGaN/GaN) to form a metal-insulator-semiconductor high electron mobility transistor (MIS-HEMT). This extended the 50 nm ALD Al2O3 MIS-HEMT (50-MIS) current-voltage (Ids-Vds) and gate leakage (Ig,leakage) characteristics up to 600 °C. Both, the 10 nm ALD Al2O3 MIS-HEMT (10-MIS) and HEMT, failed above 350 °C, as evidenced by a sudden increase of approximately 50 times and 5.3 × 106 times in Ig,leakage, respectively. AES o...

A microfabricated sun sensor using GaN-on-sapphire ultraviolet photodetector arrays

A miniature sensor for detecting the orientation of incident ultraviolet light was microfabricated using gallium nitride (GaN)-on-sapphire substrates and semi-transparent interdigitated gold electrodes for sun sensing applications. The individual metal-semiconductor-metal photodetector elements were shown to have a stable and repeatable response with a high sensitivity (photocurrent-to-dark current ratio (PDCR) = 2.4 at -1 V bias) and a high responsivity (3200 A/W at -1 V bias) under ultraviolet (365 nm) illumination. The 3 × 3 GaN-on-sapphire ultraviolet photodetector array was integrated with a gold aperture to realize a miniature sun sensor (1.35 mm × 1.35 mm) capable of determining incident light angles with a ±45° field of view. Using a simple comparative figure of merit algorithm, measurement of incident light angles of 0° and 45° was quantitatively and qualitatively (visually) demonstrated by the sun sensor, supporting the use of GaN-based sun sensors for orientation, navigation, and tracking of the sun within the harsh environment of space.

Emerging GaN-based HEMTs for mechanical sensing within harsh environments

Gallium nitride based high-electron-mobility transistors (HEMTs) have been investigated extensively as an alternative to Si-based power transistors by academia and industry over the last decade. It is well known that GaN-based HEMTs outperform Si-based technologies in terms of power density, area specific on-state resistance and switching speed. Recently, wide band-gap material systems have stirred interest regarding their use in various sensing fields ranging from chemical, mechanical, biological to optical applications due to their superior material properties. For harsh environments, wide bandgap sensor systems are deemed to be superior when compared to conventional Si-based systems. A new monolithic sensor platform based on the GaN HEMT electronic structure will enable engineers to design highly efficient propulsion systems widely applicable to the automotive, aeronautics and astronautics industrial sectors. In this paper, the advancements of GaN-based HEMTs for mechanical sensing applications are discussed. Of particular interest are multilayered heterogeneous structures where spontaneous and piezoelectric polarization between the interface results in the formation of a 2-dimensional electron gas (2DEG). Experimental results presented focus on the signal transduction under strained operating conditions in harsh environments. It is shown that a conventional AlGaN/GaN HEMT has a strong dependence of drain current under strained conditions, thus representing a promising future sensor platform. Ultimately, this work explores the sensor performance of conventional GaN HEMTs and leverages existing technological advances available in power electronics device research. The results presented have the potential to boost GaN-based sensor development through the integration of HEMT device and sensor design research.

Characterization of the piezoresistance in highly doped p-type 3C-SiC at cryogenic temperatures

This paper reports on the piezoresistive effect in p-type 3C-SiC thin film mechanical sensing at cryogenic conditions. Nanothin 3C-SiC films with a carrier concentration of 2 × 1019 cm−3 were epitaxially grown on a Si substrate using the LPCVD process, followed by photolithography and UV laser engraving processes to form SiC-on-Si pressure sensors. The magnitude of the piezoresistive effect was measured by monitoring the change of the SiC conductance subjected to pressurizing/depressurizing cycles at different temperatures. Experimental results showed a relatively stable piezoresistive effect in the highly doped 3C-SiC film with the gauge factor slightly increased by 20% at 150 K with respect to that at room temperature. The data was also in good agreement with theoretical analysis obtained based on the charge transfer phenomenon. This finding demonstrates the potential of 3C-SiC for MEMS sensors used in a large range of temperatures from cryogenic to high temperatures.

Low-temperature and pressure response of InAlN/GaN ring-shaped high electron mobility transistors

A ring-shaped InAlN/GaN high electron mobility transistor (HEMT) is leveraged as the sensing element of a micro-pressure sensor. The microfabrication process, which uses an InAlN/GaN-on-Si substrate, enables monolithic integration with other electronic devices, as well as operation within harsh environments. The micro-pressure sensor was characterized from 0 to 14 psig at room temperature (RT) and −3°C. Current-voltage (I-V) measurements under applied pressures exhibited a decrease in percent change in current (sensitivity) at −3°C, compared to RT. At RT and −3°C (Vg<inf>S</inf> = — 4 V), the maximum current sensitivity is 0.61%/psig (at V<inf>DS</inf> = 3.4 V) and 0.39%/psig (at V<inf>DS</inf> = 4 V), respectively. These results suggest that the InAlN/GaN platform can extend sensing capabilities to cold harsh environments (e.g., space and Arctic exploration).