Canfeng Wang

Synthesis and characterization of new disilane -containing arylacetylene resin

Abstract A novel disilane-containing arylacetylene resin, abbreviated as DSA resin, was synthesized from diethynylbenzene and halogenated disilane by Grignard reaction. The obtained resin was a viscous liquid and soluble in a variety of common solvents. The structures and properties of the resin, cured resin and sintered resin were characterized by FT-IR, 1H-NMR, DSC, TGA and XRD techniques. The results showed that the DSA resin could cure at temperatures lower than 200°C and the cured resin exhibited high temperature resistance and good ceramic formability.

A New Silicon-Containing Arylacetylene Resin With Amine Groups as Precursor to Si―C―N Ceramic

A new preceramic precursor was prepared by chlorination and ammoniation reaction of poly(methylsilyleneethynylenephenyleneethynylene) (MSEPE), [−SiH(CH3)− C≡C−C6H4−C≡C−]n. The obtained amine-modified silicon-containing arylacetylene resin (MSEPE-An) was a liquid polymer at room temperature and could be thermally cross-linked at temperatures lower than 200°C. The chemical structure of MSEPE-An was characterized by FTIR, 1H NMR, and GPC. The pyrolysis of the cured MSEPE-An was carried out in N2 atmosphere up to 1450°C to produce a Si−C−N ceramic composite. The ceramic composite was analyzed by FTIR and X-ray diffraction techniques. The electromagnetic wave absorption properties of a paraffin sample with 10 vol% Si−C−N ceramic powders were characterized in a frequency range of 2–18 GHz, according to a conventional reflection/transmission technique. Experimental results demonstrated that the Si−C−N ceramic composite provided good electromagnetic wave absorption performance.