Carl B. Freidhoff

Fabrication of micronozzles using low-temperature wafer-level bonding with SU-8

This paper describes a method for fabricating micronozzles using low-temperature wafer-level adhesive bonding with SU-8. The influence of different parameters on the bonding of structured wafers has been investigated. The surface energies of bonded wafers are measured to be in the range of 0.42–0.56 J m−2, which are comparable to those of some directly bonded wafers. Converging–diverging nozzle structures with throat widths as small as 3.6 µm are formed in an SU-8 film bonded with another SU-8 intermediate layer to produce sealed micronozzles. A novel interconnection technique is developed to interface and test the micronozzles with a macroscopic fluid delivery system to demonstrate the feasibility of the fabrication process. Leakage test results show that this low-temperature wafer bonding process is a viable MEMS fabrication technique for microfluidic applications.

Comparative analysis of the planar capacitor and IDT piezoelectric thin-film micro-actuator models

A comparison of the analysis of similarly developed microactuators is presented. Accurate modeling and simulation techniques are vital for piezoelectrically actuated microactuators. Coupling analytical and numerical modeling techniques with variational design parameters, accurate performance predictions can be realized. Axi-symmetric two-dimensional and three-dimensional static deflection and harmonic models of a planar capacitor actuator are presented. Planar capacitor samples were modeled as unimorph diaphragms with sandwiched piezoelectric material. The harmonic frequencies were calculated numerically and compared well to predicted values and deformations. The finite element modeling reflects the impact of the d31 piezoelectric constant. Two-dimensional axi-symmetric models of circularly interdigitated piezoelectrically membranes are also presented. The models include the piezoelectric material and properties, the membrane materials and properties, and incorporates various design considerations of the model. These models also include the electro-mechanical coupling for piezoelectric actuation and highlight a novel approach to take advantage of the higher d33 piezoelectric coupling coefficient. Performance is evaluated for varying parameters such as electrode pitch, electrode width, and piezoelectric material thickness. The models also showed that several of the design parameters were naturally coupled. The static numerical models correlate well with the maximum static deflection of the experimental devices. Finally, this paper deals with the development of numerical harmonic models of piezoelectrically actuated planar capacitor and interdigitated diaphragms. The models were able to closely predict the first two harmonics, conservatively predict the third through sixth harmonics and predict the estimated values of center deflection using plate theory. Harmonic frequency and deflection simulations need further correlation by conducting extensive iterative harmonic simulations and experiments. The results, conclusions and potential improvements are discussed.