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Carl Deppisch

Intel

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Publication

Featured researches published by Carl Deppisch.

JOM | 2006

The material optimization and reliability characterization of an indium-solder thermal interface material for CPU packaging

Carl Deppisch; Thomas Fitzgerald; Arun Raman; Fay Hua; Charles Zhang; Pilin Liu; Mikel R. Miller

Archive | 2011

Forming a semiconductor package including a thermal interface material

M. Renavikar; Daewoong Suh; Carl Deppisch; Abhishek Gupta

Archive | 2008

Heat sink with preattached thermal interface material and method of making same

Sabina J. Houle; Carl Deppisch

Archive | 2003

DEVICE AND SYSTEM FOR HEAT SPREADER WITH CONTROLLED THERMAL EXPANSION

Thomas J. Fitzgerald; Carl Deppisch; Fay Hua

Archive | 2006

COATED THERMAL INTERFACE IN INTEGRATED CIRCUIT DIE

Susheel G. Jadhav; Carl Deppisch

Archive | 2006

Capillary underflow integral heat spreader

Carl Deppisch; Tom Fitzgerald; Fay Hua; Wei Shi; Mike Gasparek

Archive | 2004

In-situ alloyed solders, articles made thereby, and processes of making same

Edward L. Martin; Tiffany A. Byrne; Carl Deppisch

Archive | 2010

Composite solder TIM for electronic package

Tom Fitzgerald; Carl Deppisch; Fay Hua

Archive | 2008

Methods of fabricating robust integrated heat spreader designs and structures formed thereby

Abhishek Gupta; Mike Boyd; Carl Deppisch; Jinlin Wang; Daewoong Suh; Brad Drew

Archive | 2009

Thermisches Löt-Grenzflächen-Verbundmaterial für ein elektronisches Gehäuse

Tom Fitzgerald; Carl Deppisch; Fay Hua

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Collaboration

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Fay Hua

Intel

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Thomas Fitzgerald

Intel

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Tom Fitzgerald

Intel

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Abhishek Gupta

Intel

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Daewoong Suh

Intel

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Sabina J. Houle

Intel

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Arun Raman

Princeton University

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Brad Drew

Intel

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Charles Zhang

Intel

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Edward L. Martin

Intel

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