Carrie Schmidt

Kovar Micro Heat Pipe Substrates for Microelectronic Cooling

We describe the development of a new technology for cooling microelectronics. This report documents the design, fabrication, and prototype testing of micro scale heat pipes embedded in a flat plate substrate or heat spreader. A thermal model tuned to the test results enables us to describe heat transfer in the prototype, as well as evaluate the use of this technology in other applications. The substrate walls are Kovar alloy, which has a coefficient of thermal expansion close to that of microelectronic die. The prototype designs integrating micro heat pipes with Kovar enhance thermal conductivity by more than a factor of two over that of Kovar alone, thus improving the cooling of micro-electronic die.

Bio micro fuel cell grand challenge final report.

Christopher Apblett, Kent Schubert, Bruce Kelley, Andrew Walker, Blake Simmons, Ted Borek, Stephen Meserole, Todd Alam, Brian Cherry, Greg Roberts, Jim Novak, Jim Hudgens, Dave Peterson, Jason Podgorski, Susan Brozik, Jeb Flemming, Stan Kravitz, David Ingersoll, Steve Eisenbies, Randy Shul, Sarah Rich, Carrie Schmidt, Mike Beggans, Jeanne Sergeant, Chris Cornelius, Cy Fujimoto, Micheal Hickner, Swapnil Chabra, Suzanne Ma, Joanne Volponi, Micheal Kelly, Kevin Zavadil, Chad Staiger, Patricia Dolan, Monica Manginell, Jason Harper, Dan Doughty, Steve Casalnuovo

Cost effective Precision 3D Glass Microfabrication for Electronic Packaging

The most singular focus of the electronics industry during the last 50 years has been to miniaturize ICs by miniaturization of transistors and on-chip interconnections. Two major problems are fores...

Cost Effective Production of Glass Interposers for 3D ICs Using APEX(TM) Glass Ceramic

The most singular focus of the electronics industry during the last 50 years has been to miniaturize ICs by miniaturization of transistors and on-chip interconnections. Two major problems are foreseen with this approach; electrical leakage and lack of improved electrical performance beyond 16nm. As a result, industry is transitioning from the current SOC-based approach to a through-silicon-via (TSV) based 3D IC-stacked approach. However, a major challenge remains; these 3D ICs need to be interconnected to other ICs with a much higher number of I/Os than are available with current ceramic or organic interposers. While silicon interposers currently in development can provide these high I/Os, they cannot do so at low enough cost. In this talk, we will present on our efforts in glass interposers fabrication. Glass interposers possess many advantages over silicon interposers including: cost, production time, and scale. Life MicroFabs APEX™ Glass ceramic is a photo-sensitive material used to create high densit...