Chandan Joishi

Modulation-doped β-(Al0.2Ga0.8)2O3/Ga2O3 field-effect transistor

Modulation-doped heterostructures are a key enabler for realizing high mobility and better scaling properties for high performance transistors. We report the realization of a modulation-doped two-dimensional electron gas (2DEG) at the β-(Al0.2Ga0.8)2O3/Ga2O3 heterojunction by silicon delta doping. The formation of a 2DEG was confirmed using capacitance voltage measurements. A modulation-doped 2DEG channel was used to realize a modulation-doped field-effect transistor. The demonstration of modulation doping in the β-(Al0.2Ga0.8)2O3/Ga2O3 material system could enable heterojunction devices for high performance electronics.

Demonstration of high mobility and quantum transport in modulation-doped β-(AlxGa1-x)2O3/Ga2O3 heterostructures

In this work, we demonstrate a high mobility two-dimensional electron gas (2DEG) formed at the β-(AlxGa1-x)2O3/Ga2O3 interface through modulation doping. Shubnikov-de Haas (SdH) oscillations were observed in the modulation-doped β-(AlxGa1-x)2O3/Ga2O3 structure, indicating a high-quality electron channel formed at the heterojunction interface. The formation of the 2DEG channel was further confirmed by the weak temperature dependence of the carrier density, and the peak low temperature mobility was found to be 2790 cm2/Vs, which is significantly higher than that achieved in bulk-doped Beta-phase Gallium Oxide (β-Ga2O3). The observed SdH oscillations allowed for the extraction of the electron effective mass in the (010) plane to be 0.313 ± 0.015 m0 and the quantum scattering time to be 0.33 ps at 3.5 K. The demonstrated modulation-doped β-(AlxGa1-x)2O3/Ga2O3 structure lays the foundation for future exploration of quantum physical phenomena and semiconductor device technologies based on the β-Ga2O3 material s...

Low-pressure CVD-grown β-Ga2O3 bevel-field-plated Schottky barrier diodes

We report (010)-oriented β-Ga2O3 bevel-field-plated mesa Schottky barrier diodes grown by low-pressure chemical vapor deposition (LPCVD) using a solid Ga precursor and O2 and SiCl4 sources. Schottky diodes with good ideality and low reverse leakage were realized on the epitaxial material. Edge termination using beveled field plates yielded a breakdown voltage of −190 V, and maximum vertical electric fields of 4.2 MV/cm in the center and 5.9 MV/cm at the edge were estimated, with extrinsic R ON of 3.9 mΩcm2 and extracted intrinsic R ON of 0.023 mΩcm2. The reported results demonstrate the high quality of homoepitaxial LPCVD-grown β-Ga2O3 thin films for vertical power electronics applications, and show that this growth method is promising for future β-Ga2O3 technology.

Improved n-channel Ge gate stack performance using HfAlO high-k dielectric for various Al concentrations

We demonstrate improved Ge n-channel gate stack performance versus HfO2 using HfAlO high-k dielectric for a wide (1.5–33%) range of Al% and post-high-k-deposition annealing (PDA) at 400 °C. Addition of Al to HfO2 is shown to mitigate degradation of the GeO2/Ge interface during PDA. HfAlO stacks with an equivalent oxide thickness (EOT) of 8 nm and large Al% exhibit improved transistor mobility (1.8 times higher) and midgap D it (2 times lower), whereas thin (1.9 nm) EOT HfAlO stacks show reduced gate leakage J g (by 10 times) and D it (by 1.5 times) and 1.6 times higher mobility for Al% as low as 1.5% at matched EOT.

Plasma-assisted low energy N2 implant for Vfb tuning of Ge gate stacks

This work reports Vfb tuning of TiN/HfO2 gate stacks on Ge using low energy plasma-assisted doping with N2 without significant impact on gate capacitance and gate/channel interface trap densities. As required for multi-VT Ge p-FinFETs, controlled change in effective work function up to 180 mV from the near midgap to the near valence band edge of Ge is demonstrated by varying implant dose and energy. Unlike Si gate stacks, increased gate leakage in implanted Ge gate stacks is shown to result from traps created in the HfO2 layer during the implant and exposed to channel carriers due to a low band offset GeO2 interfacial layer (IL). Recovery of gate leakage is demonstrated by substituting GeO2 with an Al2O3 IL. Further, a simple physical model is proposed to extract the work function and oxide charge components of the change in Vfb for varying implant doses and energies.

Demonstration of β-(AlxGa1-x)2O3/Ga2O3 double heterostructure field effect transistors

In this work, we demonstrate modulation-doped β-(AlxGa1-x)2O3/Ga2O3 double heterostructure field effect transistors. The maximum sheet carrier density for a two-dimensional electron gas (2DEG) in a β-(AlxGa1-x)2O3/Ga2O3 heterostructure is limited by the conduction band offset and parasitic channel formation in the barrier layer. We demonstrate a double heterostructure to realize a β-(AlxGa1-x)2O3/Ga2O3/(AlxGa1-x)2O3 quantum well, where electrons can be transferred from below and above the β-Ga2O3 quantum well. The confined 2DEG charge density of 3.85 × 1012 cm−2 was estimated from the low-temperature Hall measurement, which is higher than that achievable in a single heterostructure. Hall mobilities of 1775 cm2/V·s at 40 K and 123 cm2/V·s at room temperature were measured. Modulation-doped double heterostructure field effect transistors showed a maximum drain current of IDS = 257 mA/mm, a peak transconductance (gm) of 39 mS/mm, and a pinch-off voltage of −7.0 V at room temperature. The three-terminal off-s...

Temperature and field dependent low frequency noise characterization of Ge n-FETs

We report temperature (RT-150 K) and field dependent low frequency noise measurements on Ge n-FETs. Specifically, we delineate the temperature, field, and interfacial layer (GeON vs. GeO2) dependence of the gate overdrive index (β) on corresponding changes in volume interface trap density (Nit) and mobility (μ). For Nit   1 × 1020 cm−3eV−1 near the conduction band edge, changes in μ as well as Nit determine the noise mechanism. Finally, we show that the β values of Ge n-FETs are significantly different from conventional Si transistors as well as Ge p-FETs at RT and 150 K due to much higher Nit and/or μ values of the Ge n-FETs.

Trapping Effects in Si -Doped -Ga2O3 MESFETs on an Fe-Doped -Ga2O3 Substrate

Threshold voltage instability was observed on

Effect of buffer iron doping on delta-doped β-Ga2O3 metal semiconductor field effect transistors

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Ultrafast PBTI characterization on Si-free gate last Ge nFETs with stable and ultrathin Al 2 O 3 IL

-Ga2O3 transistors using double-pulsed current–voltage and constant drain current deep level transient spectroscopy (DLTS) measurements. A total instability of 0.78 V was attributed to two distinct trap levels, at