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Chao-Yi Chen

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Publication

Featured researches published by Chao-Yi Chen.

Archive | 2006

Dissipation Heat Pipe Structure and Manufacturing Method Thereof

Ming-Hang Hwang; Yu-Chiang Cheng; Chao-Yi Chen; Hsin-Lung Kuo; Bin-Wei Lee; Wei-Chung Hsiao

Archive | 2006

Heat Sink Fin Structure and Manufacturing Method Thereof

Ming-Hang Hwang; Yu-Chiang Cheng; Chao-Yi Chen; Ping-Feng Lee; Hsin-Lung Kuo; Bin-Wei Lee; Wei-Chung Hsiao

Archive | 2006

Air Blown Chip Dissipation Device and Manufacturing Method Thereof

Ming-Hang Hwang; Yu-Chiang Chen; Chao-Yi Chen; Ping-Feng Lee; Hsin-Lung Kuo; Bin-Wei Lee; Wei-Chung Hsiao

Archive | 2006

Air cooler system for chips with fan, numerous cooling fins, cooler body and heat exchange tube, with cooler body formed by metal and crystalline carbon of high heat

Chao-Yi Chen; Yu-Chiang Cheng; Wei-Chung Hsiao; Ming-Hang Hwang; Hsin-Lung Kuo; Bin-Wei Lee; Ping-Feng Lee

Archive | 2006

Printed Circuit Board Structure and Manufacturing Method Thereof

Ming-Hang Hwang; Yu-Chiang Cheng; Chao-Yi Chen; Hsin-Lung Kuo; Bin-Wei Lee; Wei-Chung Hsiao

Archive | 2006

Heat Conduction Interface Method and Manufacturing Method Thereof

Ming-Hang Hwang; Yu-Chiang Cheng; Chao-Yi Chen; Hsin-Lung Kuo; Bin-Wei Lee; Wei-Chung Hsiao

Archive | 2006

Chip heat dissipation structure and manufacturing method

Ming-Hang Hwang; Yu-Chiang Cheng; Chao-Yi Chen; Ping-Feng Lee; Hsin-Lung Kuo; Bin-Wei Lee; Wei-Chung Hsiao

Archive | 2006

Cooling system for IC (integrated circuit) chips used in e.g. personal computer, has heat sink connected to heat exchanger by connecting tubes through which liquid from pump circulates to cool IC chip

Chao-Yi Chen; Yu-Chiang Cheng; Wei-Chung Hsiao; Ming-Hang Hwang; Hsin-Lung Kuo; Bin-Wei Lee; Ping-Feng Lee

Archive | 2006

Chip Heat Dissipation System and Manufacturing Method and Structure of Heat Dissipation Device Thereof

Ming-Hang Hwang; Yu-Chiang Cheng; Chao-Yi Chen; Ping-Feng Lee; Hsin-Lung Kuo; Bin-Wei Lee; Wei-Chung Hsiao

Archive | 2006

Heat sink for e.g. north bridge chip, has housing and heat contact layer provided between upper surface of chip and lower surface of housing, where housing is made of heat conducting material having metal and crystalline carbon

Chao-Yi Chen; Yu-Chiang Cheng; Wei-Chung Hsiao; Ming-Hang Hwang; Hsin-Lung Kuo; Bin-Wei Lee; Ping-Feng Lee

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