Charles J. Sherman

Photonic packaging using laser/receiver arrays and flexible optical circuits

Optoelectronic modules and multifiber optical connectors were successfully applied to intrasystem interconnection within a large telecommunication transmission terminal. The optoelectronic modules are 32-channel 850 nm vertical cavity surface emitting laser (VCSEL) and detector arrays packaged using multichip module technology system components include multimode silica optical fibers and silicon V-groove technology based multifiber optical connectors. The system architecture presented particularly difficult challenges for parallel optics because of complex cable assemblies required by the fan-out nature of the cables and the signal bifurcation needed to accomplish duplication, Nevertheless, the experiments completed demonstrate that parallel optics can dramatically increase the capacity of telecommunications equipment with no significant changes in system or physical architecture. The density of the optical modules and connectors clearly demonstrates that optical interconnection technology will be able to support the input/output (I/O) requirements of new generations of integrated circuit technology.

System level packaging of high density optoelectronic interconnections

Large telecommunication switching and transmission platforms have massive interconnection requirements which have been doubling every 12-18 months. A discontinuity in interconnection requirements and total system bandwidth caused by DWDM technology and all optical switching technology is about to cause an enormous increase in interconnection requirements. This will result in a substantial increase in the number of fibers in a system, a substantial increase in the number of optical fibers per circuit board or unit in a system, and a substantial increase in the bandwidth carried per optical fiber in a system. Totally new packaging concepts will be required to cope with rapid changes. Past changes in optoelectronic packaging have tended to be evolutionary rather than revolutionary. The early years of the 2000 decade will require revolutionary changes in optoelectronic packaging in order just to keep pace with the pacing technologies and for the demand for bandwidth.

Intrasystem interconnection in telecommunication platforms using plastic optical fiber

Large telecommunication switching and transmission platforms have massive interconnection requirements which are in the 1 Tb/s range and growing rapidly. Plastic optical fiber technology shows promise as a replacement for both metallic interconnection and glass optical fiber interconnection. The high bandwidth characteristics of graded index plastic optical fiber (GI POF) are particularly attractive in these applications which require high reliability and high bandwidth interconnection over short distances.