Chen Wei
Tianjin University
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Publication
Featured researches published by Chen Wei.
Transactions of Nonferrous Metals Society of China | 2006
Jun Shen; Yongchang Liu; Yajing Han; Houxiu Gao; Chen Wei; Yu-qin Yang
Abstract The microstructure and microhardness of Sn-3.5%Ag solders were explored in the cooling rate ranging from 0.08 to 104 K/s. Under rapid cooling condition, the strong kinetic undercooling effect leads to the actual solidification process starting at the temperature lower than the equilibrium eutectic point, and the actual metastable eutectic point shifts to the higher Ag concentration. Hence, the higher the applied cooling rate is, the more the volume fraction of primary β-Sn crystal forms. At the same time, the separation of primary β-Sn crystal favors restraining the formation of bulk Ag3Sn intermetallic compounds (IMCs) in solder due to the mismatch crystalline orientation relationship, those Ag3Sn phase separating through the eutectic reaction could hardly cling to the primary β-Sn crystal and grow up. Additionally, the Vickers hardness test shows that fine β-Sn and spherical Ag3Sn phase in the rapidly solidified alloy strongly improves the microhardness of the Sn-3.5%Ag solder.
Microelectronics Reliability | 2010
Chen Wei; Yong Liu; Liming Yu; Hao Chen; Xu Wang
Abstract Tensile testing of Sn–3.7Ag–0.9Zn–xAl (xxa0=xa00, 0.5 and 1.0xa0wt.%) solders have been performed and the failure mechanism was investigated. The results suggest that the addition of Al in the Sn–3.7Ag–0.9Zn solder decreases both the tensile strength and ductility. Moreover, a brittle fracture occurs instead of a ductile fracture with increasing Al content. The fractographs suggest that the fracture mechanism of Sn–Ag–Zn eutectic solder is microvoid coalescence fracture, and the Sn–3.7Ag–0.9Zn–xAl (xxa0=xa00.5 and 1.0) solder corresponds to quasi-cleavage crack and cleavage fracture respectively.
Journal of Electronic Materials | 2005
Jun Shen; Yongchang Liu; Houxiu Gao; Chen Wei; Y. Q. Yang
Journal of Alloys and Compounds | 2009
Yanhua Zhang; Yongchang Liu; Yajing Han; Chen Wei; Zhiming Gao
Journal of Alloys and Compounds | 2009
Chen Wei; Yongchang Liu; Zhiming Gao; Ronglei Xu; Kai Yang
Journal of Alloys and Compounds | 2009
Chen Wei; Yongchang Liu; Zhiming Gao; Changsheng Ma; Jingbo Wan
Applied Physics A | 2009
Xu Wang; Y.C. Liu; Chen Wei; Liming Yu; Zhiming Gao; Zhizhong Dong
Archive | 2010
Yongchang Liu; Ronglei Xu; Zongqing Ma; Qian Zhao; Liming Yu; Chen Wei
Journal of Materials Science: Materials in Electronics | 2009
Peng Jiang; Yongchang Liu; Chen Wei; Jingbo Wan; Ronglei Xu; Zhiming Gao
Journal of Electronic Materials | 2009
Chen Wei; Yongchang Liu; Zhiming Gao; Jingbo Wan; Changsheng Ma