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Featured researches published by Chen Wei.


Transactions of Nonferrous Metals Society of China | 2006

Effects of cooling rates on microstructure and microhardness of lead-free Sn-3.5% Ag solders

Jun Shen; Yongchang Liu; Yajing Han; Houxiu Gao; Chen Wei; Yu-qin Yang

Abstract The microstructure and microhardness of Sn-3.5%Ag solders were explored in the cooling rate ranging from 0.08 to 104 K/s. Under rapid cooling condition, the strong kinetic undercooling effect leads to the actual solidification process starting at the temperature lower than the equilibrium eutectic point, and the actual metastable eutectic point shifts to the higher Ag concentration. Hence, the higher the applied cooling rate is, the more the volume fraction of primary β-Sn crystal forms. At the same time, the separation of primary β-Sn crystal favors restraining the formation of bulk Ag3Sn intermetallic compounds (IMCs) in solder due to the mismatch crystalline orientation relationship, those Ag3Sn phase separating through the eutectic reaction could hardly cling to the primary β-Sn crystal and grow up. Additionally, the Vickers hardness test shows that fine β-Sn and spherical Ag3Sn phase in the rapidly solidified alloy strongly improves the microhardness of the Sn-3.5%Ag solder.


Microelectronics Reliability | 2010

Effects of Al on the failure mechanism of the Sn–Ag–Zn eutectic solder

Chen Wei; Yong Liu; Liming Yu; Hao Chen; Xu Wang

Abstract Tensile testing of Sn–3.7Ag–0.9Zn–xAl (xxa0=xa00, 0.5 and 1.0xa0wt.%) solders have been performed and the failure mechanism was investigated. The results suggest that the addition of Al in the Sn–3.7Ag–0.9Zn solder decreases both the tensile strength and ductility. Moreover, a brittle fracture occurs instead of a ductile fracture with increasing Al content. The fractographs suggest that the fracture mechanism of Sn–Ag–Zn eutectic solder is microvoid coalescence fracture, and the Sn–3.7Ag–0.9Zn–xAl (xxa0=xa00.5 and 1.0) solder corresponds to quasi-cleavage crack and cleavage fracture respectively.


Journal of Electronic Materials | 2005

Formation of bulk Ag3Sn intermetallic compounds in Sn-Ag lead-free solders in solidification

Jun Shen; Yongchang Liu; Houxiu Gao; Chen Wei; Y. Q. Yang


Journal of Alloys and Compounds | 2009

The role of cooling rate in the microstructure of Al–Fe–Si alloy with high Fe and Si contents

Yanhua Zhang; Yongchang Liu; Yajing Han; Chen Wei; Zhiming Gao


Journal of Alloys and Compounds | 2009

Effects of aging on structural evolution of the rapidly solidified Sn–Ag–Zn eutectic solder

Chen Wei; Yongchang Liu; Zhiming Gao; Ronglei Xu; Kai Yang


Journal of Alloys and Compounds | 2009

Effects of small addition of In on the structure of the rapidly cooled Sn-Ag-Zn solder

Chen Wei; Yongchang Liu; Zhiming Gao; Changsheng Ma; Jingbo Wan


Applied Physics A | 2009

Effects of composition and cooling rate on the microstructure of Sn–3.7Ag–0.9Zn–Bi solders

Xu Wang; Y.C. Liu; Chen Wei; Liming Yu; Zhiming Gao; Zhizhong Dong


Archive | 2010

Method of producing tin-silver-zinc system leadless soldering plaster

Yongchang Liu; Ronglei Xu; Zongqing Ma; Qian Zhao; Liming Yu; Chen Wei


Journal of Materials Science: Materials in Electronics | 2009

Effect of high-temperature annealing on the microstructural formation of Sn–3.7Ag–0.9Zn–xAl lead-free solder

Peng Jiang; Yongchang Liu; Chen Wei; Jingbo Wan; Ronglei Xu; Zhiming Gao


Journal of Electronic Materials | 2009

Effects of Thermal Aging on Microstructure and Microhardness of Sn-3.7Ag-0.9Zn-1In Solder

Chen Wei; Yongchang Liu; Zhiming Gao; Jingbo Wan; Changsheng Ma

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