Cheng-Da Wu

Effects of temperature, loading rate and nanowire length on torsional deformation and mechanical properties of aluminium nanowires investigated using molecular dynamics simulation

Single-crystal aluminium nanowires under torsion are studied using molecular dynamics simulations based on the many-body tight-binding potential. The effects of temperature, loading rate and nanowire length are evaluated in terms of atomic trajectories, potential energy, von Mises stress, a centrosymmetry parameter, torque, shear modulus and radial distribution function. Simulation results clearly show that torsional deformation begins at the surface, extends close to the two ends and finally diffuses to the middle part. The critical torsional angle which represents the beginning of plastic deformation varies with different conditions. Before the critical torsional angle is reached, the potential energy and the torque required for the deformation of a nanowire significantly increase with the torsional angle. The critical torsional angle increases with increasing nanowire length and loading rate and decreasing temperature. The torque required for the deformation decreases and the shear modulus increases with increasing nanowire length. For higher temperatures and higher loading rates, torsional buckling more easily occurs at the two ends of a nanowire, whereas it occurs towards the middle part at or below room temperature with lower loading rates. Geometry instability occurs before material instability (buckling) for a long nanowire.

Formation Mechanism and Mechanics of Dip-Pen Nanolithography Using Molecular Dynamics

Molecular dynamics simulations are used to investigate the mechanisms of molecular transference, pattern formation, and mechanical behavior in the dip-pen nanolithography (DPN) process. The effects of deposition temperature were studied using molecular trajectories, the meniscus characteristic, surface absorbed energy, and pattern formation analysis. At the first transferred stage (at the initial indentation depth), the conformation of SAM molecules lies almost on the substrate surface. The molecules start to stand on the substrate due to the pull and drag forces at the second transferred stage (after the tip is pulled up). According to the absorbed energy behavior, the second transferred stage has larger transferred amounts and the transfer rate is strongly related to temperature. When molecules were deposited at low temperature (e.g., room temperature), the pattern shape was more highly concentrated. The pattern shape at high temperatures expanded and the area increased because of good molecular diffusion.

Elasticity and nanomechanical response of Aspergillus niger spores using atomic force microscopy

The elasticity and nanomechanical response of Aspergillus niger spores determined using atomic force microscopy (AFM) and nanoindentation are discussed. The force-displacement curve of the spore surfaces shows that the average surface roughness of spores was approximately 33 nm and that the adhesion force ranged from 9 to 28 nN. The Youngs modulus of the A. niger spores ranged from 0.1 to 21.4 GPa and the hardness ranged from 0.01 to 0.17 GPa. The critical buckling load of the spore membrane is 290 μN.

Atomistic simulations of nanowelding of single-crystal and amorphous gold nanowires

The mechanism and quality of the welding of single-crystal (SC) and amorphous gold nanowires (NWs) with head-to-head contact are studied using molecular dynamics simulations based on the second-moment approximation of the many-body tight-binding potential. The results are discussed in terms of atomic trajectories, slip vectors, stress, and radial distribution function. Simulation results show that the alignment for the amorphous NWs during welding is easier than that for the SC NWs due to the formers relatively stable geometry. A few dislocations nucleate and propagate on the (111) close-packed plane (slip plane) inside the SC NWs during the welding and stretching processes. During welding, an incomplete jointing area first forms through the interactions of the van der Waals attractive force, and the jointing area increases with increasing extent of contact between the two NWs. A crystallization transition region forms in the jointing area for the welding of SC-amorphous or amorphous-SC NWs. With increasing interference, an amorphous gold NW shortens more than does a SC gold NW due to the formers relatively poor strength. The pressure required for welding decreases with increasing temperature.

Study of deformation and shape recovery of NiTi nanowires under torsion.

The nanomechanical properties, deformation, and shape recovery mechanism of NiTi nanowires (NWs) under torsion are studied using molecular dynamics simulations. The effects of loading rate, aspect ratio of NWs, and NW shape are evaluated in terms of atomic trajectories, potential energy, torque required for deformation, stress, shear modulus, centro-symmetry parameter, and radial distribution function. Simulation results show that dislocation nucleation starts from the surface and then extends to the interior along the {110} close-packed plane. For a high loading rate, the occurrence of torsional buckling of a NW is faster, and the buckling gradually develops near the location of the applied external loading. The critical torsional angle and critical buckling angle increase with aspect ratio of the NWs. Square NWs have better mechanical strength than that of circular NWs due to the effect of shape. Shape recovery naturally occurs before buckling.

Molecular Dynamics Simulations of the Roller Nanoimprint Process: Adhesion and Other Mechanical Characteristics.

Molecular dynamics simulations using tight-binding many body potential are carried out to study the roller imprint process of a gold single crystal. The effect of the roller tooth’s taper angle, imprint depth, imprint temperature, and imprint direction on the imprint force, adhesion, stress distribution, and strain are investigated. A two-stage roller imprint process was obtained from an imprint force curve. The two-stage imprint process included the imprint forming with a rapid increase of imprint force and the unloading stage combined with the adhesion stage. The results show that the imprint force and adhesion rapidly increase with decreasing taper angle and increasing imprint depth. The magnitude of the maximum imprint force and the time at which this maximum occurs are proportional to the imprint depth, but independent of the taper angle. In a comparison of the imprint mechanisms with a vertical imprint case, while high stress and strain regions are concentrated below the mold for vertical imprint, they also occur around the mold in the case of roller imprint. The regions were only concentrated on the substrate atoms underneath the mold in vertical imprint. Plastic flow increased with increasing imprint temperature.

Effect of chain length of self-assembled monolayers in dip-pen nanolithography using molecular dynamics simulations

The pattern transfer mechanism of an alkanethiol self-assembled monolayer (SAM) with different chain lengths during the dip-pen nanolithography (DPN) process and pattern characterizations are studied using molecular dynamics (MD) simulations. The mechanisms of molecular transference, alkanethiol meniscus characteristics, surface adsorbed energy, transfer number, and pattern formation are evaluated during the DPN process at room temperature. The simulation results clearly show that the molecular transfer ability in DPN is strongly dependent on the chain length. Shorter molecules have significantly better transport and diffusion abilities between the meniscus and substrate surface, and the transport period can be maintained longer. The magnitude of adsorbed energy increases with chain length, so many more molecules can be transferred to the surface when shorter molecules are used. After deposition, the magnitude of the adsorbed area and pattern height decrease with increasing chain length.

Effect of temperature on welding of metallic nanowires investigated using molecular dynamics simulations

The mechanism of welding of Au–Au, Ag–Ag and Au–Ag nanowires (NWs) with head-to-head contact is studied using molecular dynamics simulations based on the second-moment approximation of the many-body tight-binding potential. The effect of temperature in the range of 300–900 K is investigated. Simulation results show that at the initial welding, an incomplete jointing area forms through the interactions of the van der Waals attractive force, and that the jointing area increases with increasing the extent of contact between the two NWs during the welding process and temperature. Few defects form along the (1 1 1) close-packed plane during the welding process because the acting stress is quite low. Among the three NW pairs, the Au–Au NWs have the best cold-welding quality, whereas the Au–Ag NWs have the worst cold-welding quality due to the welding of different materials. With an increase in temperature, the weld stress and the mechanical strength of the NWs significantly decrease, and the number of disordered structures increases. The welding fails when the temperature exceeds the molten temperature of the NWs.

Analysis of welding Au nanowires into T junctions

Abstract The effects of temperature and size on the welding of Au nanowires (NWs) into T junctions is studied using molecular dynamics simulations based on the second-moment approximation of the many-body tight-binding potential. Simulation results show that when the top NW approaches the bottom one, it elongates towards the bottom one just before welding due to the interaction of the van der Waals attractive force. During welding, the bottom NW gradually reaches critical bend deformation through successive pressure applied from the top one, followed by buckling of the top NW. The structural order of NWs significantly decreases with increasing welding temperature or decreasing NW width. Welding at high temperatures (700 K or above) causes alignment difficulty due to an unstable NW geometry or even welding failure due to a decrease in NW length. Smaller NWs have larger stress during the welding process.

Nanomilling mechanism on Cu surfaces investigated using atomistic simulation

The nanoscale milling and scratching processes of copper workpieces are studied using molecular dynamics simulations based on the tight-binding and Morse potentials. The effects of the rotation velocity of the tool and the workpiece temperature are evaluated in terms of atomic trajectories, slip vectors, flow field of chips, cutting forces and groove characteristics. The simulation shows that a slip system in the ⟨110⟩ direction on the workpiece surface occurs for milling with a tool rotation velocity of ω = 0°/fs. However, no apparent slip system appears for ω = 0.005°/fs or higher; instead, the number of amorphous areas increases. At ω = 0°/fs (nanoscratching), most of the removed atoms pile up in front of the tool and some gradually backfill when the tool rotates due to the effects of rotational friction and adhesion between the tool and the removed atoms. The largest number of removed atoms that piled up in front of the tool were obtained for milling with ω = 0°/fs; the number of removed atoms that piled up in front of the tool decreased with the increasing ω value. The component forces corresponding to the feed direction of the tool are the largest for the nanodrilling and nanomilling processes. High-precision grooves can be obtained at a low workpiece temperature (e.g. room temperature) with ω = 0°/fs.