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Cheng Dai

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Hotspot

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Publication

Featured researches published by Cheng Dai.

Archive | 2012

PCB (Printed Circuit Board) technology capable of increasing heat dissipation effect

Fang Dai; Cheng Dai; Xianglan Liu; Xiangli Liu

Archive | 2012

Tin spraying technology for spraying of liquid metal solder microparticle

Fang Dai; Cheng Dai; Xianglan Liu; Xiangli Liu

Archive | 2012

Technology and device for preventing overlying as taking and placing lump-shaped objects

Fang Dai; Cheng Dai; Xianglan Liu; Xiangli Liu

Archive | 2012

Manufacture technology for surface-coarsened glass fiber

Fang Dai; Cheng Dai; Xianglan Liu; Xiangli Liu

Archive | 2012

Manufacture technology for high-frequency material

Fang Dai; Cheng Dai; Xianglan Liu; Xiangli Liu

Archive | 2012

Rivet for press positioning and riveting print circuit board

Fang Dai; Cheng Dai; Xianglan Liu; Xiangli Liu

Archive | 2012

Tin spraying technology added with spraying solder tiny particles

Fang Dai; Cheng Dai; Xianglan Liu; Xiangli Liu

Archive | 2012

Nested rivet for pre-location of multi-layer printed circuit board

Fang Dai; Cheng Dai; Xianglan Liu; Xiangli Liu

Archive | 2012

Non-uniform-thickness material rivet

Fang Dai; Cheng Dai; Xianglan Liu; Xiangli Liu

Archive | 2012

Printed circuit board capable of improving heat dissipation effect

Fang Dai; Cheng Dai; Xianglan Liu; Xiangli Liu

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Collaboration

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