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Featured researches published by Cheng-Ying Ho.


Materials Chemistry and Physics | 1997

Subcritical crack growth behavior for hydrided Zircaloy-4 plate

Jia-Hong Huang; Cheng-Ying Ho

Abstract To study the subcritical crack growth (SCG) behavior for hydrided Zircaloy-4 plate, sustained load tests were performed on fatigue precracked specimens in Ar atmosphere at 200, 250, and 300 °C with hydrogen contents up to 290 ppm. Log crack velocity versus stress intensity curves showed typical three-stage crack growth behavior. The values of threshold stress intensity (Kth) were not sensitive to both temperature and hydrogen content and were about a constant value, 21 MPa m . The crack growth velocity at stage II, (da/dt)II, increased with increasing temperature. In general, the SCG behavior is not consistent with the classical Dutton-Puls delayed hydride cracking model, except for the specimen containing 110 ppm H tested at 200°C. On the basis of metallographic and fractographic results, the crack propagation process is proposed. The critical stress intensity, Kc, decreased with increasing hydrogen content, which indicates that the effect of increasing hydrogen concentration is to shorten the K range in stage II.


Materials Chemistry and Physics | 1994

Effect of hydrogen gas on the mechanical properties of a zirconium alloy

Jia-Hong Huang; Cheng-Ying Ho

Abstract To study the mechanical properties of Zircaloy-4 in hydrogen gas, notched Zircaloy-4 plate specimens were tested in a hydrogen gas environment of various pressures up to 2020 kPa at 25, 100 and 200°C. The results showed that, for all test temperatures, the notch tensile strength of Zircaloy-4 was slightly increased with hydrogen pressure until 101 kPa and then decreased with increasing hydrogen pressure. A ductile-brittle transition of reduction of area at 25°C was found when the alloy was tested at hydrogen pressure between 101 and 1010 kPa. From the fractographic finding, the ductile-brittle transition was closely related to the precipitation of brittle hydrides. The ductile-brittle transition became less distinct at 100°C and above. This was attributed to the improved ductility of zirconium matrix with increasing temperature.


Journal of Materials Science | 2013

Microstructural variation and high-speed impact responses of Sn–3.0Ag–0.5Cu/ENEPIG solder joints with ultra-thin Ni–P deposit

Cheng-Ying Ho; Jenq-Gong Duh; Chih-Wei Lin; Chun-Jen Lin; Yu-Hui Wu; Huei-Cheng Hong; Te-Hui Wang


Materials Letters | 2013

Wetting kinetics and wettability enhancement of Pd added electrolytic Ni surface with molten Sn–3.0Ag–0.5Cu solder

Cheng-Ying Ho; Jenq-Gong Duh


Materials Science and Engineering A-structural Materials Properties Microstructure and Processing | 2014

Effects of thermal annealing in the post-reflow process on microstructure, tin crystallography, and impact reliability of Sn–Ag–Cu solder joints

Wen-Lin Chen; Chi-Yang Yu; Cheng-Ying Ho; Jenq-Gong Duh


Materials Chemistry and Physics | 2014

Quantifying the dependence of Ni(P) thickness in ultrathin-ENEPIG metallization on the growth of Cu–Sn intermetallic compounds in soldering reaction

Cheng-Ying Ho; Jenq-Gong Duh


Materials Science and Engineering A-structural Materials Properties Microstructure and Processing | 2014

Optimal Ni(P) thickness design in ultrathin-ENEPIG metallization for soldering application concerning electrical impedance and mechanical bonding strength

Cheng-Ying Ho; Jenq-Gong Duh


Materials Letters | 2013

Retardation of (Cu,Ni)6Sn5 spalling in Sn–Ag–Cu/Ni solder joints via controlling the grain structure of Ni metallization layer

Yi-Hsin Wu; Chi-Yang Yu; Cheng-Ying Ho; Jenq-Gong Duh


Journal of Alloys and Compounds | 2014

Crystallographic characterization and growth behavior of (Cu,Ni,Pd)6Sn5 intermetallic compound in Ni(P)/Pd/Au/SnAgCu/Cu assembled solder joint

Chien-Fu Tseng; Cheng-Ying Ho; Joseph Ya-min Lee; Jenq-Gong Duh


Microelectronics Reliability | 2015

Interfacial reaction and mechanical evaluation in multi-level assembly joints with ENEPIG under bump metallization via drop and high speed impact test

Hsiu-Min Lin; Cheng-Ying Ho; Wen-Lin Chen; Yi-Hsin Wu; De-Hui Wang; Jun-Ren Lin; Yu-Hui Wu; Huei-Cheng Hong; Zhi-Wei Lin; Jenq-Gong Duh

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Jenq-Gong Duh

National Tsing Hua University

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Jia-Hong Huang

National Tsing Hua University

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Chi-Yang Yu

National Tsing Hua University

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Wen-Lin Chen

National Tsing Hua University

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Yi-Hsin Wu

National Tsing Hua University

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Chien-Fu Tseng

National Tsing Hua University

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Hsiu-Min Lin

National Tsing Hua University

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Joseph Ya-min Lee

National Tsing Hua University

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S.-P. Huang

National Tsing Hua University

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