Chengyan Liu

Quad flat non-lead (QFN) package with high density and manufacturing method

Package and manufacture method for thermal enhanced quad flat no-lead flip chip

Semiconductor package-in-package (PiP) system structure

On-chip chip package and production method thereof

FCOC (Flip Chip On Chip) package and manufacturing method thereof

Flip chip on-chip package and manufacturing method thereof

Advanced four-side flat pin-free package and manufacturing method thereof

High-density quad flat non-lead packaging

Thermal-enhanced flip-chip quad flat non-lead package

Package in Package (PiP) Electronic Device and Manufacturing Method thereof