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Chengyan Liu

Beijing University of Technology

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Publication

Featured researches published by Chengyan Liu.

Archive | 2012

Quad flat non-lead (QFN) package with high density and manufacturing method

Fei Qin; Guofeng Xia; Tong An; Wei Wu; Chengyan Liu

Archive | 2012

Package and manufacture method for thermal enhanced quad flat no-lead flip chip

Fei Qin; Guofeng Xia; Tong An; Wei Wu; Chengyan Liu

Archive | 2012

Semiconductor package-in-package (PiP) system structure

Fei Qin; Guofeng Xia; Tong An; Chengyan Liu; Wei Wu

Archive | 2012

On-chip chip package and production method thereof

Fei Qin; Guofeng Xia; Tong An; Chengyan Liu; Wei Wu

Archive | 2012

FCOC (Flip Chip On Chip) package and manufacturing method thereof

Fei Qin; Guofeng Xia; Tong An; Chengyan Liu; Wei Wu

Archive | 2012

Flip chip on-chip package and manufacturing method thereof

Fei Qin; Guofeng Xia; Tong An; Chengyan Liu; Wei Wu

Archive | 2012

Advanced four-side flat pin-free package and manufacturing method thereof

Fei Qin; Guofeng Xia; Tong An; Wei Wu; Chengyan Liu

Archive | 2012

High-density quad flat non-lead packaging

Fei Qin; Guofeng Xia; Tong An; Wei Wu; Chengyan Liu

Archive | 2012

Thermal-enhanced flip-chip quad flat non-lead package

Fei Qin; Guofeng Xia; Tong An; Wei Wu; Chengyan Liu

Archive | 2012

Package in Package (PiP) Electronic Device and Manufacturing Method thereof

Fei Qin; Guofeng Xia; Tong An; Wei Wu; Chengyan Liu

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Collaboration

Dive into the Chengyan Liu's collaboration.

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Fei Qin

Beijing University of Technology

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Guofeng Xia

Beijing University of Technology

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Wei Wu

Beijing University of Technology

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Tong An

Beijing University of Technology

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