Cheol-Ho Park

9.2: Sequential Lateral Solidification (SLS) Process for Large Area AMOLED

We have demonstrated that the sequential lateral solidification (SLS) technology can be utilized for the large area AMOLED. An optimized SLS process provides us with polycrystalline Si films with well-controlled grain size and location. The thin film transistors (TFTs) with SLS-processed Si films show high performance with desirable uniformity. 14″ WXGA (1280×RGB×768) AMOLEDs were fabricated with SLS-processed TFT backplanes. We utilized RGB evaporation process with fine metal mask. The novel delta pixel arrangement results in increased aperture ratio and wider FMM process window. The advantage of SLS process will be discussed.

9.2: Line-Scan Sequential Lateral Solidification Process for AMOLED Application

We have demonstrated that thin film transistor backplanes for AMOLED could be fabricated with line-scan sequential lateral solidification (SLS) process. with 4 μm × 730 mm single laser beamlet, directional and two-shot SLS processes were carried out to make polycrystalline Si films. The geometry for driving TFTs, which can provide sufficient uniformity of TFT performances, is that the source-drain direction is perpendicular to the grain growth direction. 14″ WXGA (1366×RGB×768) AMOLEDsfor TV application were fabricated by utilizing different TFT geometry for driving TFTs and switching TFTs. The advantages of the line-scan SLS system are (1) it can provide higher productivity than the conventional laser system and (2) large displays over 50″ can be manufactured without scan overlap area.