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Chia-Chung Wang

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Publication

Featured researches published by Chia-Chung Wang.

Archive | 2008

Chip-scale packaged light-emitting devices

Paul Panaccione; Charles W.C. Lin; Chia-Chung Wang; Cheng-Chung Chen

Archive | 2011

Method of making a semiconductor chip assembly with a bump/base heat spreader and an inverted cavity in the bump

Charles W. C. Lin; Chia-Chung Wang

Archive | 2003

Semiconductor chip assembly with chip in substrate cavity

Chia-Chung Wang; Charles W. C. Lin

Archive | 2011

Method of making stackable semiconductor assembly with bump/base/flange heat spreader and build-up circuitry

Charles W. C. Lin; Chia-Chung Wang

Archive | 2010

METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A POST/BASE HEAT SPREADER AND A CAVITY OVER THE POST

Charles W. C. Lin; Chia-Chung Wang; Sangwhoo Lim

Archive | 2005

Semiconductor chip assembly with metal containment wall and solder terminal

Charles W. C. Lin; Chia-Chung Wang

Archive | 2011

Method of making thermally enhanced semiconductor assembly with bump/base/flange heat spreader and build-up circuitry

Charles W. C. Lin; Chia-Chung Wang

Archive | 2009

Semiconductor chip assembly with post/base heat spreader and vertical signal routing

Chia-Chung Wang; Charles W. C. Lin

Archive | 2009

METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A POST/BASE HEAT SPREADER AND VERTICAL SIGNAL ROUTING

Chia-Chung Wang; Charles W. C. Lin

Archive | 2007

Stackable semiconductor package having metal pin within through hole of package

Cheng-Chung Chen; Chia-Chung Wang; Chin Hock Tan; Charles W.C. Lin

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Collaboration

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