Chien-Fong Lo

Development of enhancement mode AlN/GaN high electron mobility transistors

Enhancement mode AlN/GaN high electron mobility transistors (HEMTs) were fabricated from originally depletion-mode structures using oxygen plasma treatment on the gate area prior to the gate metallization. Starting with a depletion mode AlN/GaN HEMT, the threshold voltage of the HEMT could be shifted from −3.2 to 1 V depending on the oxygen plasma treatment time to partially convert the AlN barrier layer into Al oxide. The gate current was reduced and the current-voltage curves show metal-oxide semiconductor diodelike characteristics after oxygen plasma treatment.

Effect of Coated Platinum Thickness on Hydrogen Detection Sensitivity of Graphene-Based Sensors

The effect of Pt metal thickness on the hydrogen sensing sensitivity of Pt-coated, multi-layered graphene grown by chemical vapor deposition on Si-polar 4H-SiC, was investigated. As-grown graphene samples and graphene samples coated with 1 or 4 nm thick Pt films were used in this study. Compared to graphene without platinum, significantly improved hydrogen detection sensitivity was observed with the addition of platinum films. The highest hydrogen sensitivity was observed with the graphene sensor with 1 nm platinum coating. The platinum coated graphene sensor also showed good selectivity for hydrogen detection over methane, ammonia, oxygen, and nitrogen oxide.

Isolation blocking voltage of nitrogen ion-implanted AlGaN/GaN high electron mobility transistor structure

Nitrogen ion-implanted AlGaN/GaN high electron mobility transistor structures showed an isolation blocking voltage of 900 V with a leakage current at 1 μA/mm across an implanted isolation-gap of 10 μm between two Ohmic pads. The effect of implanted gap distance (1.7, 5, or 10 μm) between two Ohmic contact pads was evaluated. The isolation current density was determined to be solely dependent on the applied field between the contact pads. A model using a combination of resistive current and Poole–Frenkel current is consistent with the experimental data. The resistance of the isolation implantation region significantly decreased after the sample was annealed at temperatures above 600 °C.

Effect of humidity on hydrogen sensitivity of Pt-gated AlGaN/GaN high electron mobility transistor based sensors

The effects of relative humidity on sensing characteristics of Pt-gated AlGaN/GaN high electron mobility transistor diode based hydrogen sensors were investigated. The absorbed water and oxygen molecules blocked available Pt surface adsorption sites for H2 absorption and reduced the hydrogen sensing sensitivity compared to low humidity conditions. The hydrogen sensing sensitivity decreased proportional to the relative humidity. However, the presence of humidity improved the sensor recovery characteristics after exposure to the hydrogen ambient.

Electric-Field-Driven Degradation in off-State Step-Stressed AlGaN/GaN High-Electron Mobility Transistors

The critical degradation voltage of AlGaN/GaN high-electron mobility transistors during off-state electrical stress was determined as a function of Ni/Au gate dimensions (0.1-0.17 μm), drain bias voltage, and source/drain-gate contact distance. Devices with different gate lengths and gate-drain distances were found to exhibit the onset of degradation at different source-drain biases but similar electric field strengths, showing that the degradation mechanism is primarily field driven. The degradation field was calculated to be ~ 1.8 MV/cm by Automatically Tuned Linear Algebra Software simulations. Transmission electron microscopy imaging showed creation of defects under the gate after dc stress.

Reliability studies of AlGaN/GaN high electron mobility transistors

AlGaN/GaN high electron mobility transistors are gaining commercial acceptance for use in high power and high frequency applications, but the degradation mechanisms that drive failure in the field are not completely understood. Since some of these mechanisms are current or field driven, reliability studies must go beyond the typical Arrhenius-accelerated life tests. In this paper, we summarize recent work on electric field or current driven degradation in devices with different gate metallization, device dimensions, electric field mitigation techniques (such as source field plates) and the effect of device fabrication processes for both dc and RF stress conditions.

Dependence on proton energy of degradation of AlGaN/GaN high electron mobility transistors

The effects of proton irradiation energy on dc, small signal, and large signal rf characteristics of AlGaN/GaN high electron mobility transistors (HEMTs) were investigated. AlGaN/GaN HEMTs were irradiated with protons at fixed fluence of 5 × 1015/cm2 and energies of 5, 10, and 15 MeV. Both dc and rf characteristics revealed more degradation at lower irradiation energy, with reductions of maximum transconductance of 11%, 22%, and 38%, and decreases in drain saturation current of 10%, 24%, and 46% for HEMTs exposed to 15, 10, and 5 MeV protons, respectively. The increase in device degradation with decreasing proton energy is due to the increase in linear energy transfer and corresponding increase in nonionizing energy loss with decreasing proton energy in the active region of the HEMTs. After irradiation, both subthreshold drain leakage current and reverse gate current decreased more than 1 order of magnitude for all samples. The carrier removal rate was in the range 121–336 cm−1 over the range of proton energies employed in this study.

Degradation Mechanisms for GaN and GaAs High Speed Transistors

We present a review of reliability issues in AlGaN/GaN and AlGaAs/GaAs high electron mobility transistors (HEMTs) as well as Heterojunction Bipolar Transistors (HBTs) in the AlGaAs/GaAs materials systems. Because of the complex nature and multi-faceted operation modes of these devices, reliability studies must go beyond the typical Arrhenius accelerated life tests. We review the electric field driven degradation in devices with different gate metallization, device dimensions, electric field mitigation techniques (such as source field plate), and the effect of device fabrication processes for both DC and RF stress conditions. We summarize the degradation mechanisms that limit the lifetime of these devices. A variety of contact and surface degradation mechanisms have been reported, but differ in the two device technologies: For HEMTs, the layers are thin and relatively lightly doped compared to HBT structures and there is a metal Schottky gate that is directly on the semiconductor. By contrast, the HBT relies on pn junctions for current modulation and has only Ohmic contacts. This leads to different degradation mechanisms for the two types of devices.

Effects of proton irradiation energies on degradation of AlGaN/GaN high electron mobility transistors

The authors report the proton energy dependence of the degradation of AlGaN/GaN high electron mobility transistors (HEMTs) with GaN cap layers from 5 to 15 MeV at a fixed dose of 5 × 1015 cm−2. All the samples degraded after proton irradiation. However, higher damage in dc electrical properties was observed at lower proton energies. Saturation currents at VDS = 6 V and VGS = 0 V reduced by 47% after proton irradiation at 5 MeV energy, but the reduction was less by 25% and 9% at 10 and 15 MeV, respectively. Similar trends were observed in other electrical properties [transconductance (gm) and gate leakage currents]. This energy dependence from 5 to 15 MeV can be explained by the energy-dependent penetration depth of the proton. Protons with higher kinetic energy can penetrate deeper while creating less numbers of defects at shallow depths where the active layers of the HEMTs are located. These results are in good agreement with stopping and range of ions in matter results. The optimization of the AlGaN/GaN...

Minipressure sensor using AlGaN/GaN high electron mobility transistors

AlGaN/GaN high electron mobility transistors (HEMTs) with a polarized polyvinylidene difluoride (PVDF) film coated on the gate area exhibited significant changes in channel conductance upon exposure to different ambient pressures. The PVDF thin film was deposited on the gate region with an ink-jet plotter. Next, the PDVF film was polarized with an electrode located 2 mm above the PVDF film at a bias voltage of 10 kV and 70 °C. Variations in ambient pressure induced changes in the charge in the polarized PVDF, leading to a change in surface charges on the gate region of the HEMT. Changes in the gate charge were amplified through the modulation of the drain current in the HEMT. By reversing the polarity of the polarized PVDF film, the drain current dependence on the pressure could be reversed. Our results indicate that HEMTs have potential for use as pressure sensors.AlGaN/GaN high electron mobility transistors (HEMTs) with a polarized polyvinylidene difluoride (PVDF) film coated on the gate area exhibited significant changes in channel conductance upon exposure to different ambient pressures. The PVDF thin film was deposited on the gate region with an ink-jet plotter. Next, the PDVF film was polarized with an electrode located 2 mm above the PVDF film at a bias voltage of 10 kV and 70 °C. Variations in ambient pressure induced changes in the charge in the polarized PVDF, leading to a change in surface charges on the gate region of the HEMT. Changes in the gate charge were amplified through the modulation of the drain current in the HEMT. By reversing the polarity of the polarized PVDF film, the drain current dependence on the pressure could be reversed. Our results indicate that HEMTs have potential for use as pressure sensors.