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Chien-Ping Huang

Siliconware Precision Industries Company, Ltd.

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Publication

Featured researches published by Chien-Ping Huang.

Archive | 1999

Thermally enhanced quad flat non-lead package of semiconductor

Chien-Ping Huang; Eric Ko

Archive | 1999

Quad flat non-lead package of semiconductor

Chien-Ping Huang; Eric Ko

Archive | 2002

Ball grid array semiconductor package and substrate without power ring or ground ring

Chien-Ping Huang; Eric Ko; Chih-Ming Huang

Archive | 2000

Package structure stacking chips on front surface and back surface of substrate

Randy H. Y. Lo; Chien-Ping Huang; Chi-Chuan Wu

Archive | 2001

Multiple stacked-chip packaging structure

Randy H. Y. Lo; Chien-Ping Huang; Chi-Chuan Wu

Archive | 2000

Universal lead frame type of quad flat non-lead package of semiconductor

Chien-Ping Huang; Eric Ko

Archive | 2002

Structure of a multi chip module having stacked chips

Tzong-Dar Her; Randy H. Y. Lo; Chien-Ping Huang

Archive | 2003

Ball grid array semiconductor package

Chien-Ping Huang; Eric Ko; Chih-Ming Huang

Archive | 2002

Super low profile package with high efficiency of heat dissipation

Chien-Ping Huang; Tzong-Dar Her

Archive | 2000

Method of fabricating a ball grid array integrated circuit package having an encapsulating body

Chien-Ping Huang; Randy H. Y. Lo; Tzong-Da Ho; Eric Ko; Jui-Meng Jao

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