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Ching-Cheng Huang

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Publication

Featured researches published by Ching-Cheng Huang.

Archive | 2002

Integrated chip package structure using organic substrate and method of manufacturing the same

Mou-Shiung Lin; Jin-Yuan Lee; Ching-Cheng Huang

Archive | 2007

Low fabrication cost, fine pitch and high reliability solder bump

Jin-Yuan Lee; Mou Shiung Lin; Ching-Cheng Huang

Archive | 2008

Reliable metal bumps on top of I/O pads after removal of test probe marks

Ching-Cheng Huang; Chuen-Jye Lin; Ming-Ta Lei; Mou-Shiung Lin

Archive | 2007

Low fabrication cost, high performance, high reliability chip scale package

Jin Yuan Lee; Ming Ta Lei; Ching-Cheng Huang; Chuen-Jye Lin

Archive | 2008

CHIP STRUCTURE AND PROCESS FOR FORMING THE SAME

Jin-Yuan Lee; Mou-Shiung Lin; Ching-Cheng Huang

Archive | 2001

Method of making a low fabrication cost, high performance, high reliability chip scale package

Jin Yuan Lee; Ming Ta Lei; Ching-Cheng Huang; Chuen-Jye Lin

Archive | 2001

Post passivation metal scheme for high-performance integrated circuit devices

Mou-Shiung Lin; Ming-Ta Lei; Jin-Yuan Lee; Ching-Cheng Huang

Archive | 2008

Method of fabricating chip package

Jin-Yuan Lee; Ching-Cheng Huang; Mou-Shiung Lin

Archive | 2002

Thin film semiconductor package utilizing a glass substrate with composite polymer/metal interconnect layers

Mou-Shiung Lin; Jin-Yuan Lee; Ching-Cheng Huang

Archive | 2001

Structure of ceramic package with integrated passive devices

Ching-Cheng Huang; Mou-Shiung Lin; Jin-Yuan Lee

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Collaboration

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