Ching-Cheng Huang

Integrated chip package structure using organic substrate and method of manufacturing the same

Low fabrication cost, fine pitch and high reliability solder bump

Reliable metal bumps on top of I/O pads after removal of test probe marks

Low fabrication cost, high performance, high reliability chip scale package

CHIP STRUCTURE AND PROCESS FOR FORMING THE SAME

Method of making a low fabrication cost, high performance, high reliability chip scale package

Post passivation metal scheme for high-performance integrated circuit devices

Method of fabricating chip package

Thin film semiconductor package utilizing a glass substrate with composite polymer/metal interconnect layers

Structure of ceramic package with integrated passive devices