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Publication
Featured researches published by Christian Göbl.
international symposium on power semiconductor devices and ic's | 2011
Thomas Stockmeier; Peter Beckedahl; Christian Göbl; Thomas Malzer
SKiN technology comprises the sintering of power chips to a substrate (i.e. DBC), a top side sintering of the power chips to a flexible circuit board, and the sintering of the substrate to a pin-fin heat sink. The resulting power device has a very low volume and weight and demonstrates unprecedented thermal, electrical, and reliability performance. Therefore, this technology is ideally suited to provide better power electronic solutions for a range of applications, i.e. electric vehicles, renewable energies and variable speed motor drives. The process to manufacture a 400 Amp, 600 V Dual IGBT, sintered to an aluminum pin-fin heat sink will be described in detail and electrical, thermal and reliability results will be shown.
Archive | 2008
Peter Beckedahl; Heiko Braml; Christian Göbl; Heinrich Dr. Heilbronner
Archive | 2009
Christian Göbl; Peter Beckedahl; Heiko Braml; Heinrich Dr. Heilbronner
Archive | 2008
Christian Göbl; Heiko Braml; Ulrich Hermann
Archive | 2015
Christian Kroneder; Björn Tauscher; Alexej Walter; Christian Göbl; Harald Kobolla
Archive | 2011
Karlheinz Augustin; Christian Göbl; Josef Faltenbacher; Ulrich Sagebaum; Thomas Stockmeier
Archive | 2009
Tobias Fey; Christian Göbl; Christian Radüge; Ulrich Herrmann
Archive | 2009
Christian Göbl; Heiko Braml
Archive | 2007
Christian Göbl; Karlheinz Augustin; Thomas Stockmeier
Archive | 2012
Christian Göbl; Thomas Stockmeier
