Claude Sarno
Thales Group
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Publication
Featured researches published by Claude Sarno.
2008 14th International Workshop on Thermal Inveatigation of ICs and Systems | 2008
Johan Liu; Bruno Michel; Marta Rencz; Christian Tantolin; Claude Sarno; Ralf Miessner; Klaus-Volker Schuett; Xinhe Tang; Sébastien Demoustier; Afshin Ziaei
This paper provides a comprehensive review of the recent progress of research work performed to develop new thermal interface materials. The review starts by classifying existing thermal interface materials and analyzing their advantages and disadvantages. The state of the art research is then reviewed with an emphasis on those materials based on various carbon allotropes, such as graphite, carbon nanotubes (CNTs) and fibers. Other kinds of fillers with high thermal conductivity, such as silicon carbide, boron nitride, aluminum nitride, aluminum oxide, silver and other metals, have also been extensively studied. These materials are also reviewed in this paper. Besides the achievements in materials development, other methods have also been developed to further reduce the overall interface resistance, such as modifying the surfaces of the integrated chips or heat sinks. This aspect is also discussed in this paper. The paper is summarized with a perspective on the future technical trends.
international conference on design and technology of integrated systems in nanoscale era | 2008
M.C. Zaghdoudi; S. Maalej; Christian Tantolin; Claude Sarno
An experimental study is realized in order to verify the mini heat pipe concept for cooling high power dissipation electronic cards. Two kinds of card substrate are considered: alumina and FR4 epoxy substrates, and the chip on board technology is used. Different prototypes of configurations on reporting the chip on the card are tested. The thermal measurements show that the use of heat pipes allows for significantly reduced temperature gradients and maximum chip temperature decrease.
international conference on microelectronics | 2011
Mohamed Chaker Zaghdoudi; Christian Tantolin; Claude Sarno
An experimental study is realized in order to verify the mini heat pipe concept for cooling high power dissipation electronic cards. Two kinds of card substrates are considered: alumina and FR4 epoxy, and the chip on board technology is used. Different prototypes of configurations on reporting the chip on the card are tested. The thermal measurements show that the use of heat pipes allows for significantly reduced temperature gradients and maximum chip temperature decrease.
Archive | 2000
Claude Sarno; Georges Moulin
Archive | 1999
Claude Sarno; Henri Bouteille
Archive | 1999
Claude Sarno; Henri Bouteille
Archive | 1998
Claude Sarno; Henri Bouteille
Archive | 1999
Claude Sarno; Henri Bouteille
Archive | 1999
Claude Sarno; Henri Bouteille
Archive | 2011
Christian Tantolin; Claude Sarno