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Dive into the research topics where Claude Sarno is active.

Publication


Featured researches published by Claude Sarno.


2008 14th International Workshop on Thermal Inveatigation of ICs and Systems | 2008

Recent progress of thermal interface material research - an overview

Johan Liu; Bruno Michel; Marta Rencz; Christian Tantolin; Claude Sarno; Ralf Miessner; Klaus-Volker Schuett; Xinhe Tang; Sébastien Demoustier; Afshin Ziaei

This paper provides a comprehensive review of the recent progress of research work performed to develop new thermal interface materials. The review starts by classifying existing thermal interface materials and analyzing their advantages and disadvantages. The state of the art research is then reviewed with an emphasis on those materials based on various carbon allotropes, such as graphite, carbon nanotubes (CNTs) and fibers. Other kinds of fillers with high thermal conductivity, such as silicon carbide, boron nitride, aluminum nitride, aluminum oxide, silver and other metals, have also been extensively studied. These materials are also reviewed in this paper. Besides the achievements in materials development, other methods have also been developed to further reduce the overall interface resistance, such as modifying the surfaces of the integrated chips or heat sinks. This aspect is also discussed in this paper. The paper is summarized with a perspective on the future technical trends.


international conference on design and technology of integrated systems in nanoscale era | 2008

Use of mini heat pipes for the thermal management of high dissipative electronic packages

M.C. Zaghdoudi; S. Maalej; Christian Tantolin; Claude Sarno

An experimental study is realized in order to verify the mini heat pipe concept for cooling high power dissipation electronic cards. Two kinds of card substrate are considered: alumina and FR4 epoxy substrates, and the chip on board technology is used. Different prototypes of configurations on reporting the chip on the card are tested. The thermal measurements show that the use of heat pipes allows for significantly reduced temperature gradients and maximum chip temperature decrease.


international conference on microelectronics | 2011

Use of flat miniature heat pipes for the thermal management of electronic packages

Mohamed Chaker Zaghdoudi; Christian Tantolin; Claude Sarno

An experimental study is realized in order to verify the mini heat pipe concept for cooling high power dissipation electronic cards. Two kinds of card substrates are considered: alumina and FR4 epoxy, and the chip on board technology is used. Different prototypes of configurations on reporting the chip on the card are tested. The thermal measurements show that the use of heat pipes allows for significantly reduced temperature gradients and maximum chip temperature decrease.


Archive | 2000

ELECTRONIC MODULE WITH HIGH COOLING POWER

Claude Sarno; Georges Moulin


Archive | 1999

Connecting device for an assembly of line replaceable modules for electronic wallets and rack equipped with same for receiving such an assembly

Claude Sarno; Henri Bouteille


Archive | 1999

Device for inserting, extracting and locking a module in a bay

Claude Sarno; Henri Bouteille


Archive | 1998

Aircraft line replaceable module connection method involves directly applying sliding module section and openings with connector block coupling distribution network

Claude Sarno; Henri Bouteille


Archive | 1999

Dispositif d'insertion, d'extraction et de verrouillage d'un module dans une baie

Claude Sarno; Henri Bouteille


Archive | 1999

Simplified modular structure

Claude Sarno; Henri Bouteille


Archive | 2011

Cooling an electronic device

Christian Tantolin; Claude Sarno

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Frédéric Lefèvre

Institut national des sciences Appliquées de Lyon

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R. Hodot

Institut national des sciences Appliquées de Lyon

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