Clemens Kunisch

Forming mandrels for x-ray telescopes made of modified Zerodur

For the next generation of X-ray observatories (CONSTELLATION-X and XEUS) a mass production of glass mirror segments is considered. The mirror substrates (SCHOTT D263 and SCHOTT BOROFLOAT 33) will be pre-shaped in a high temperature slumping process by use of precision forming mandrels. SCHOTT GLAS developed the glass ceramic material ZERODUR K20 to meet the requirements of these mandrels. The new material is a modification of the well-known ZERODUR. A heat driven transformation thereby changes the crystalline phase from high-quartz to keatite structure. The resulting ZERODUR K20 exhibits an increased stability at high temperatures of up to 850°C and a low thermal expansion coefficient (CTE) of approximately 20•10-7 K-1 (20°-700°C). Numerical simulations of the slumping process based on experimental parameters of Zerodur K20 and the mirror substrate materials are presented.

ZERODUR: progress in CTE characterization

In 2010, SCHOTT introduced a method for the modeling of the thermal expansion behavior of ZERODUR® under arbitrary temperature profiles for an optimized production of material for the upcoming Extremely Large Telescope (ELT) projects. In 2012 a new product was introduced based on this method called ZERODUR® TAILORED. ZERODUR® TAILORED provides an evolution in the specification of the absolute Coefficient of Thermal Expansion (CTE) value by including the individual customer requirements in this process. This paper presents examples showing the benefit of an application oriented approach in the design of specifications using ZERODUR®. Additionally it will be shown how the modeling approach has advanced during the last years to improve the prediction accuracy on long time scales. ZERODUR® is known not only for its lowest CTE but also for its excellent CTE homogeneity as shown in the past for disc shaped blanks typical for telescope mirror substrates. Additionally this paper presents recent results of CTE homogeneity measurements in the single digit ppb/K range for a rectangular cast plate proving that the excellent CTE homogeneity is independent of the production format.

Effects of thermal inhomogeneity on 4m class mirror substrates

The new ground based telescope generation is moving to a next stage of performance and resolution. Mirror substrate material properties tolerance and homogeneity are getting into focus. The coefficient of thermal expansion (CTE) homogeneity is even more important than the absolute CTE. The error in shape of a mirror, even one of ZERODUR, is affected by changes in temperature, and by gradients in temperature. Front to back gradients will change the radius of curvature R that in turn will change the focus. Some systems rely on passive athermalization and do not have means to focus. Similarly changes in soak temperature will result in surface changes to the extent there is a non-zero coefficient of thermal expansion. When there are in-homogeneities in CTE, the mirror will react accordingly. Results of numerical experiments are presented discussing the impact of CTE in-homogeneities on the optical performance of 4 m class mirror substrates. Latest improvements in 4 m class ZERODUR CTE homogeneity and the thermal expansion metrology are presented as well.

ZERODUR thermo-mechanical modelling and advanced dilatometry for the ELT generation

Large amounts of low thermal expansion material are required for the upcoming ELT projects. The main mirror is designed using several hundreds of hexagonal 1.4 m sized mirror blanks. The M2 and M3 are monolithic 4 m class mirror blanks. The mirror blank material needs to fulfill tight requirements regarding CTE specification and homogeneity. Additionally the mirror blanks need to be dimensionally stable for more than 30 years. In particular, stress effects due to the changes in the environment shall not entail shape variation of more than 0.5 μm PV within 30 years. In 2010 SCHOTT developed a physically based model to describe the thermal and mechanical long time behavior of ZERODUR. The model enables simulation of the long time behavior of ZERODUR mirror blanks under realistic mechanical and thermal constraints. This presentation shows FEM simulation results on the long time behavior of the ELT M1, M2 and M3 mirror blanks under different loading conditions. Additionally the model results will be compared to an already 15 years lasting long time measurement of a ZERODUR sample at the German federal physical standardization institute (PTB). In recent years SCHOTT pushed the push rod dilatometer measurement technology to its limit. With the new Advanced Dilatometer CTE measurement accuracies of +- 3 ppb/K and reproducibilities of better 1 ppb/K have been achieved. The new Advanced Dilatometer exhibits excellent long time stability.

Next generation dilatometer for highest accuracy thermal expansion measurement of ZERODUR

In the recent years, the ever tighter tolerance for the Coefficient of thermal expansion (CTE) of IC Lithography component materials is requesting significant progress in the metrology accuracy to determine this property as requested. ZERODUR® is known for its extremely low CTE between 0°C to 50°C. The current measurement of the thermal expansion coefficient is done using push rod dilatometer measurement systems developed at SCHOTT. In recent years measurements have been published showing the excellent CTE homogeneity of ZERODUR® in the one-digit ppb/K range using these systems. The verifiable homogeneity was limited by the CTE(0°C, 50°C) measurement repeatability in the range of ± 1.2 ppb/K of the current improved push rod dilatometer setup using an optical interferometer as detector instead of an inductive coil. With ZERODUR® TAILORED, SCHOTT introduced a low thermal expansion material grade that can be adapted to individual customer application temperature profiles. The basis for this product is a model that has been developed in 2010 for better understanding of the thermal expansion behavior under given temperature versus time conditions. The CTE behavior predicted by the model has proven to be in very good alignment with the data determined in the thermal expansions measurements. The measurements to determine the data feeding the model require a dilatometer setup with excellent stability and accuracy for long measurement times of several days. In the past few years SCHOTT spent a lot of effort to drive a dilatometer measurement technology based on the push rod setup to its limit, to fulfill the continuously demand for higher CTE accuracy and deeper material knowledge of ZERODUR®. This paper reports on the status of the dilatometer technology development at SCHOTT.

Glass ceramic ZERODUR enabling nanometer precision

The IC Lithography roadmap foresees manufacturing of devices with critical dimension of < 20 nm. Overlay specification of single digit nanometer asking for nanometer positioning accuracy requiring sub nanometer position measurement accuracy. The glass ceramic ZERODUR® is a well-established material in critical components of microlithography wafer stepper and offered with an extremely low coefficient of thermal expansion (CTE), the tightest tolerance available on market. SCHOTT is continuously improving manufacturing processes and it’s method to measure and characterize the CTE behavior of ZERODUR® to full fill the ever tighter CTE specification for wafer stepper components. In this paper we present the ZERODUR® Lithography Roadmap on the CTE metrology and tolerance. Additionally, simulation calculations based on a physical model are presented predicting the long term CTE behavior of ZERODUR® components to optimize dimensional stability of precision positioning devices. CTE data of several low thermal expansion materials are compared regarding their temperature dependence between - 50°C and + 100°C. ZERODUR® TAILORED 22°C is full filling the tight CTE tolerance of +/- 10 ppb / K within the broadest temperature interval compared to all other materials of this investigation. The data presented in this paper explicitly demonstrates the capability of ZERODUR® to enable the nanometer precision required for future generation of lithography equipment and processes.