Corrado Bongiorno

Formation and evolution of luminescent Si nanoclusters produced by thermal annealing of SiOx films

Si nanoclusters embedded in SiO2 have been produced by thermal annealing of SiOx films prepared by plasma enhanced chemical vapor deposition. The structural properties of the system have been investigated by energy filtered transmission electron microscopy (EFTEM). EFTEM has evidenced the presence of a relevant contribution of amorphous nanostructures, not detectable by using the more conventional dark field transmission electron microscopy technique. By also taking into account this contribution, an accurate quantitative description of the evolution of the samples upon thermal annealing has been accomplished. In particular, the temperatures at which the nucleation of amorphous and crystalline Si nanoclusters starts have been determined. Furthermore, the nanocluster mean radius and density have been determined as a function of the annealing temperature. Finally, the optical and the structural properties of the system have been compared, to demonstrate that the photoluminescence properties of the system de...

Sensitizing properties of amorphous Si clusters on the 1.54-μm luminescence of Er in si-rich SiO2

In this letter, the role of amorphous Si clusters in the excitation of Er implanted in substoichiometric SiOx films will be elucidated. It will be shown that the temperature of the SiOx thermal process prior to Er implantation is crucial in determining the luminescence properties of the samples. In particular, the luminescence intensity at 1.54 μm is almost constant for SiOx samples not annealed or pre-annealed at temperatures lower than 800 °C, reaches the maximum at 800 °C, and decreases at higher temperatures. The structural properties of these samples have been studied by energy filtered transmission electron microscopy. It will be shown that for annealing temperatures lower than 1000 °C, only amorphous Si nanoclusters are present. We demonstrate that a large density of small amorphous Si clusters produces the best luminescence performance and enhances the fraction of optically active Er.

Si-based materials and devices for light emission in silicon

Abstract We report on the fabrication and performances of extremely efficient Si-based light sources. The devices consist of MOS structures with erbium (Er) implanted in the thin gate oxide. The devices exhibit strong 1.54 μm electroluminescence (EL) at 300 K with a 10% external quantum efficiency, comparable to that of standard light-emitting diodes using III–V semiconductors. Er excitation is caused by hot electrons impact and oxide wearout limits the reliability of the devices. Much more stable light-emitting MOS devices have been fabricated using Er-doped silicon rich oxide (SRO) films as gate dielectric. These devices show a high stability, with an external quantum efficiency reduced to 1%. In these devices, Er pumping occurs by energy transfer from the Si nanostructures to the rare-earth ions. Finally, we have also fabricated MOS structures with Tb- and Yb-doped SiO 2 which show room temperature EL at 540 nm (Tb) and 980 nm (Yb) with an external quantum efficiency of a 10% and 0.1%, respectively.

Origin and perspectives of the 1.54 μm luminescence from ion-beam-synthesized β-FeSi2 precipitates in Si

The structural and optical properties of β-FeSi2 precipitates in Si have been analyzed. Float zone Si samples were implanted at 250 °C with 350 keV Fe ions to fluences in the range 1–5×1015/cm2 and annealed in vacuum at 800 °C for times up to 24 h. Detailed morphological analyses of these samples, using transmission electron microscopy, reveal the presence of (i) a band of small (with a diameter 100 nm diameter) fully relaxed β-FeSi2 precipitates centered at a depth of ∼320 nm, and (iii) residual extended defects. A sharp photoluminescence peak at 1.54 μm is measured at 17 K. This peak remains unchanged when the region containing the small precipitates is removed, using Ar sputtering. On the other hand, it is also fully suppressed when the large precipitates region is removed and a high concentration of extended defects remains in the samples. This allowed us to identify the large unstrained precipitates as...

Electroluminescence and transport properties in amorphous silicon nanostructures

We report the results of a detailed study on the structural, electrical and optical properties of light emitting devices based on amorphous Si nanostructures. Amorphous nanostructures may constitute an interesting system for the monolithic integration of optical and electrical functions in Si ULSI technology. In fact, they exhibit an intense room temperature electroluminescence (EL), with the advantage of being formed at a temperature of 900 °C, while at least 1100 °C is needed for the formation of Si nanocrystals. Optical and electrical properties of amorphous Si nanocluster devices have been studied in the temperature range between 30 and 300 K. The EL is seen to have a bell-shaped trend as a function of temperature with a maximum at around 60 K. The efficiency of these devices is comparable to that found in devices based on Si nanocrystals, although amorphous nanostructures exhibit peculiar working conditions (very high current densities and low applied voltages). Time resolved EL measurements demonstrate the presence of a short lifetime, only partially due to the occurrence of non-radiative phenomena, since the very small amorphous clusters formed at 900 °C are characterized by a short radiative lifetime. By forcing a current through the device a phenomenon of charge trapping in the Si nanostructures has been observed. Trapped charges affect luminescence through an Auger-type non-radiative recombination of excitons. Indeed, it is shown that unbalanced injection of carriers (electrons versus holes) is one of the main processes limiting luminescence efficiency. These data will be reported and the advantages and limitations of this approach will be discussed.

Temperature dependence of the specific resistance in Ti∕Al∕Ni∕Au contacts on n-type GaN

The temperature dependence of the specific resistance ρc in annealed Ti∕Al∕Ni∕Au contacts on n-type GaN was monitored, obtaining information on the current transport mechanisms. After annealing at 600°C, the contacts exhibited a rectifying behavior and became Ohmic only after high temperature processes (>700°C), with ρc in the low 10−5Ωcm2 range. The results demonstrated that the current transport is ruled by two different mechanisms: thermoionic field emission occurs in the contacts annealed at 600°C, whereas field emission dominates after higher temperature annealing. The significant physical parameters related to the current transport, i.e., the Schottky barrier height and the carrier concentration under the contact, could be determined. In particular, a reduction of the Schottky barrier from 1.21eV after annealing at 600°Cto0.81eV at 800°C was determined, accompanied by a strong increase of the carrier concentration, i.e., from 2×1018cm−3 in the as-prepared sample to 4.6×1019cm−3 in the annealed conta...

Crystal nucleation and growth processes in Ge2Sb2Te5

The kinetics of the amorphous-to-crystal transition in Ge2Sb2Te5 thin films have been studied through in situ transmission electron microscopy analyses. By following the time evolution of the grain density and size, the growth velocity and the nucleation rate have been separately measured at different annealing temperatures. Activation energies of 2.9±0.5 eV and 2.3±0.4 eV have been obtained for the nucleation rate and the growth velocity, respectively. The barrier energy for the nucleation of a critical nucleus ΔG* has been evaluated, and the scalability of phase change nonvolatile memories has been estimated.

Self-organization of gold nanoclusters on hexagonal SiC and SiO2 surfaces

Very thin Au layers were deposited on SiC hexagonal and SiO2 substrates by sputtering. The Au surface diffusion, clustering, and self-organization of Au nanoclusters on these substrates, induced by thermal processes, were investigated by Rutherford backscattering spectrometry, atomic force microscopy, scanning electron microscopy, and transmission electron microscopy. On both types of substrates, clustering is shown to be a ripening process of three-dimensional structures controlled by surface diffusion and the application of the ripening theory allowed us to derive the surface diffusion coefficient and all other parameters necessary to describe the entire process. The system Au nanoclusters/SiC and Au nanoclusters/SiO2 are proposed as nanostructured materials for nanoelectronic and nanotechnology applications.

Thin crystalline 3C-SiC layer growth through carbonization of differently oriented Si substrates

The growth of thin cubic silicon carbide (3C-SiC) buffer layers in an horizontal hot-wall chemical vapor deposition reactor, through the carbonization of differently oriented Si surfaces, is presented. A qualitative and quantitative study has been performed on statistical parameters related to voids due to the buffer layer growth on the different substrate orientations emphasizing shape, size, and density as a function of the substrate orientation. Variation in the void parameters can be attributed to the atomic packing density related to the substrate orientations, which were (100) Si, (111) Si, and (110) Si in this study. Scanning electron microscopy and transmission electron microscopy were performed to analyze the surface and the crystalline quality of the 3C-SiC films grown and, eventually, an empirical model for the carbonization of Si surfaces formulated. Large platens characterize the 3C-SiC films with shapes related to the orientations of the substrate. These platens derive from the two-dimension...

Dielectric properties of Pr2O3 high-k films grown by metalorganic chemical vapor deposition on silicon

Praseodymium oxide (Pr2O3) thin films have been deposited on Si(100) substrates by metalorganic chemical vapor deposition using praseodymium tris-2,2,6,6-tetramethyl-3,5-heptandionate as source material. Film structural, morphological, and compositional characterizations have been carried out. Dielectric properties have been studied as well by capacitance–voltage and current–voltage measurements on metal-oxide-semiconductor capacitors of several areas. The Pr2O3 films have shown a dielectric constant e=23–25 and a leakage current density of 8.8×10−8 A/cm2 at +1 V.