Cs Jog

A Simulation Module for Microsystems using Hybrid Finite Elements: An Overview

We present here an overview of the work done in developing a simulation module for microsystems, which entails solving coupled partial differential equations concerning multiple physical phenomena. A distinguishing feature of this work is the use of hybrid finite elements wherein displacement and stress fields are independently interpolated to mitigate the ill effects of widely known locking phenomena in finite element analysis. A beneficial consequence of hybrid elements is that a single type of 3D element is suitable for structures of any proportions. Furthermore, for the same accuracy, the number of degrees of freedom needed in the hybrid finite element model is usually much lower as compared to the displacement-based model. In this chapter, after briefly discussing the essential aspects of hybrid elements, representative results in elastic deformation under mechanical loads, coupled electrostatic-elastic simulation, and coupled piezoresistive-elastic simulation are presented. Seamless interfacing of the analysis codes with pre- and post-processing modules of any finite element software is also noted.