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Dive into the research topics where D. Dannheim is active.

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Featured researches published by D. Dannheim.


Journal of Instrumentation | 2014

A prototype hybrid pixel detector ASIC for the CLIC experiment

P. Valerio; J Alozy; S. Arfaoui; Rafael Ballabriga; M. Benoit; S. Bonacini; M. Campbell; D. Dannheim; M. De Gaspari; D Felici; S. Kulis; X. Llopart; A. Nascetti; T. Poikela; Winnie Wong

A prototype hybrid pixel detector ASIC specifically designed to the requirements of the vertex detector for CLIC is described and first electrical measurements are presented. The chip has been designed using a commercial 65 nm CMOS technology and comprises a matrix of 64 × 64 square pixels with 25 μm pitch. The main features include simultaneous 4-bit measurement of Time-over-Threshold (ToT) and Time-of-Arrival (ToA) with 10 ns accuracy, on-chip data compression and power pulsing capability.


Journal of Instrumentation | 2013

Vertex-Detector R&D for CLIC

D. Dannheim

A detector concept based on hybrid planar pixel-detector technology is under development for the CLIC vertex detector. It comprises fast, low-power and small-pitch readout ASICs implemented in 65 nm CMOS technology (CLICpix) coupled to ultra-thin sensors via low-mass interconnects. The power dissipation of the readout chips is reduced by means of power pulsing, allowing for a cooling system based on forced gas flow. In this paper the CLIC vertex-detector requirements are reviewed and the current status of R&D on sensors, readout and detector integration is presented.A detector concept based on hybrid planar pixel-detector technology is under development for the CLIC vertex detector. It comprises fast, low-power and small-pitch readout ASICs implemented in 65 nm CMOS technology (CLICpix) coupled to ultra-thin sensors via low-mass interconnects. The power dissipation of the readout chips is reduced by means of power pulsing, allowing for a cooling system based on forced gas flow. In this paper the CLIC vertex-detector requirements are reviewed and the current status of R&D on sensors, readout and detector integration is presented.


Journal of Instrumentation | 2017

Design and characterisation of a capacitively coupled HV-CMOS sensor for the CLIC vertex detector

Iraklis Kremastiotis; I. Peric; Szymon Kulis; Rafael Ballabriga Sune; D. Dannheim; A. Fiergolski; D. Hynds; M. Campbell

The concept of capacitive coupling between sensors and readout chips is under study for the vertex detector at the proposed high-energy CLIC electron positron collider. The CLICpix Capacitively Coupled Pixel Detector (C3PD) is an active High-Voltage CMOS sensor, designed to be capacitively coupled to the CLICpix2 readout chip. The chip is implemented in a commercial 180 nm HV-CMOS process and contains a matrix of 128×128 square pixels with 25μm pitch. First prototypes have been produced with a standard resistivity of ~20 Ωcm for the substrate and tested in standalone mode. The results show a rise time of ~20 ns, charge gain of 190 mV/ke− and ~40 e− RMS noise for a power consumption of 4.8μW/pixel. The main design aspects, as well as standalone measurement results, are presented.


Nuclear Instruments & Methods in Physics Research Section A-accelerators Spectrometers Detectors and Associated Equipment | 2009

PDE-Foam—A probability density estimation method using self-adapting phase-space binning

D. Dannheim; Alexander Voigt; Karl-Johan Grahn; Peter Speckmayer; T. Carli

Probability density estimation (PDE) is a multi-variate discrimination technique based on sampling signal and background densities defined by event samples from data or Monte-Carlo (MC) simulations in a multi-dimensional phase space. In this paper, we present a modification of the PDE method that uses a self-adapting binning method to divide the multi-dimensional phase space in a finite number of hyper-rectangles (cells). The binning algorithm adjusts the size and position of a predefined number of cells inside the multi-dimensional phase space, minimising the variance of the signal and background densities inside the cells. The implementation of the binning algorithm (PDE-Foam) is based on the MC event-generation package Foam. We present performance results for representative examples (toy models) and discuss the dependence of the obtained results on the choice of parameters. The new PDE-Foam shows improved classification capability for small training samples and reduced classification time compared to the original PDE method based on range searching.


Modern Physics Letters A | 2004

EVENTS WITH ISOLATED CHARGED LEPTONS AND LARGE MISSING TRANSVERSE MOMENTUM AT HERA

T. Carli; D. Dannheim; Lorenzo Bellagamba

Striking events with isolated charged leptons, large missing transverse momentum and large transverse momentum of the hadronic final state were observed at the electron proton collider HERA in a data sample corresponding to an integrated luminosity of about 130 pb-1. The H1 collaboration observed 11 events with isolated electrons or muons and with . Only 3.4±0.6 events were expected from Standard Model (SM) processes. Six of these events have , while 1.3±0.3 events were expected. The ZEUS collaboration observed good agreement with the SM. However, ZEUS found two events with a similar event topology, but tau leptons instead of electrons or muons in the final state. Only 0.2±0.05 events were expected from SM processes. For various hypotheses, the compatibility of the experimental results was investigated with respect to the SM and with respect to possible explanations beyond the SM. Prospects for the high-luminosity HERA-II data taking period are given.


Nuclear Instruments & Methods in Physics Research Section A-accelerators Spectrometers Detectors and Associated Equipment | 2018

Allpix

Simon Spannagel; Andreas Matthias Nurnberg; N. Gauvin; M. Benoit; D. Dannheim; Koen Wolters; Mateus Vicente Barreto Pinto; Daniel Hynds; Niloufar Alipour Tehrani; Paul Schütze

Abstract Allpix2 (read: Allpix Squared) is a generic, open-source software framework for the simulation of silicon pixel detectors. Its goal is to ease the implementation of detailed simulations for both single detectors and more complex setups such as beam telescopes from incident radiation to the digitised detector response. Predefined detector types can be automatically constructed from simple model files describing the detector parameters. The simulation chain is arranged with the help of intuitive configuration files and an extensible system of modules, which implement separate simulation steps such as realistic charge carrier deposition with the Geant4 toolkit or propagation of charge carriers in silicon using a drift–diffusion model. Detailed electric field maps imported from TCAD simulations can be used to precisely model the drift behaviour of charge carriers within the silicon, bringing a new level of realism to Monte Carlo based simulations of particle detectors. This paper provides an overview of the framework and a selection of different simulation modules, and presents a comparison of simulation results with test beam data recorded with hybrid pixel detectors. Emphasis is placed on the performance of the framework itself, using a first-principles simulation of the detectors without addressing secondary ASIC-specific effects.


Journal of Instrumentation | 2015

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D. Dannheim

The precision physics needs at TeV-scale linear electron-positron colliders (ILC and CLIC) require a vertex-detector system with excellent flavour-tagging capabilities through a mea- surement of displaced vertices. This is essential, for example, for an explicit measurement of the Higgs decays to pairs of b-quarks, c-quarks and gluons. Efficient identification of top quarks in the decayt ! Wbwill give access to thettH-coupling measurement. In addition to those requirements driven by physics arguments, the CLIC bunch structure calls for hit timing at the few-ns level. As a result, the CLIC vertex-detector system needs to have excellent spatial resolution, full geometrical coverage extending to low polar angles, extremely low material budget, low occupancy facilitated by time-tagging, and sufficient heat removal from sensors and readout. These considerations chal- lenge current technological limits. A detector concept based on hybrid pixel-detector technology is under development for the CLIC vertex detector. It comprises fast, low-power and small-pitch readout ASICs implemented in 65 nm CMOS technology (CLICpix) coupled to ultra-thin planar or active HV-CMOS sensors via low-mass interconnects. The power dissipation of the readout chips is reduced by means of power pulsing, allowing for a cooling system based on forced gas flow. This contribution reviews the requirements and design optimisation for the CLIC vertex detector and gives an overview of recent R&D achievements in the domains of sensors, readout and detector integration.


Journal of Instrumentation | 2013

: A Modular Simulation Framework for Silicon Detectors

Steve Aplin; Marça Boronat; D. Dannheim; Jordi Duarte; Frank-Dieter Gaede; A. Ruiz-Jimeno; A. Sailer; Manfred Valentan; Ivan Vila; M. Vos

We present the second in a series of studies into the forward tracking system for a future linear e+e− collider with a center-of-mass energy in the range from 250 GeV to 3 TeV. In this note a number of specific challenges are investigated, which have caused a degradation of the tracking and vertexing performance in the forward region in previous experiments. We perform a quantitative analysis of the dependence of the tracking performance on detector design parameters and identify several ways to mitigate the performance loss for charged particles emitted at shallow angle.


European Physical Journal C | 2018

The CLIC Vertex Detector

H. Abramowicz; H. Henschel; T. Lesiak; M. Orlandea; S. Kananov; I. Smiljanic; A. Abusleme; Ignatenko, M.Idzik{

A prototype of a luminometer, designed for a future


Journal of Instrumentation | 2017

Forward tracking at the next e + e collider part II: experimental challenges and detector design

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I. Peric

Karlsruhe Institute of Technology

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A. Nürnberg

Karlsruhe Institute of Technology

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Szymon Kulis

AGH University of Science and Technology

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D. Hynds

University of Glasgow

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