D.G. Wei
Harvard University
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Publication
Featured researches published by D.G. Wei.
New Carbon Materials | 2010
Jian-hua Li; R.Y. Hong; Guohua Luo; Ying Zheng; Hong-zhong Li; D.G. Wei
Carbon nanotubes filled with magnetic materials are very interesting as new materials for applications in biomedicine. A simple and efficient method was developed to encapsulate Fe3O4 nanoparticles in multiwalled carbon nanotubes (MWCNTs). Transmission and scanning electron microscopy, energy dispersive X-ray analysis, and X-ray powder diffraction measurements confirmed that the Fe3O4 nanoparticles are encapsulated in the MWCNTs. The magnetic properties of the MWCNTs and the Fe3O4-filled MWCNTs were measured using a vibrating sample magnetometer. Results showed that the Fe3O4-filled MWCNTs exhibited superparamagnetism at room temperature and possessed a higher saturation magnetization (Ms) (around 13.15 emu/g) than that of the unfilled ones (around 0.35 emu/g). The MWCNTs encapsulating Fe3O4 nanoparticles have potential applications in engineering and medicine.
Biochemical Engineering Journal | 2008
R.Y. Hong; B. Feng; L.L. Chen; G.H. Liu; Hongzhong Li; Ying Zheng; D.G. Wei
Colloids and Surfaces A: Physicochemical and Engineering Aspects | 2008
B. Feng; R.Y. Hong; L.S. Wang; L. Guo; H.Z. Li; J. Ding; Ying Zheng; D.G. Wei
Applied Surface Science | 2009
R.Y. Hong; J.H. Li; S.Z. Zhang; Hongzhong Li; Ying Zheng; Jian-min Ding; D.G. Wei
Journal of Magnetism and Magnetic Materials | 2011
Y.M. Wang; X. Cao; G.H. Liu; R.Y. Hong; Y.M. Chen; X.F. Chen; H.Z. Li; B. Xu; D.G. Wei
Journal of Alloys and Compounds | 2009
R.Y. Hong; B. Feng; G. Liu; S. Wang; H.Z. Li; J. Ding; Ying Zheng; D.G. Wei
Journal of Alloys and Compounds | 2009
B. Feng; R.Y. Hong; Y.J. Wu; G. Liu; Li Zhong; Ying Zheng; J. Ding; D.G. Wei
Chemical Engineering Journal | 2009
X. Cai; R.Y. Hong; L.S. Wang; X.Y. Wang; H.Z. Li; Ying Zheng; D.G. Wei
Journal of Applied Polymer Science | 2009
R.Y. Hong; B. Feng; X. Cai; G. Liu; H.Z. Li; J. Ding; Ying Zheng; D.G. Wei
Polymers for Advanced Technologies | 2009
H.P. Fu; R.Y. Hong; Yi Zhang; H.Z. Li; B. Xu; Ying Zheng; D.G. Wei
