Daigorou Kamoto
Hitachi
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Publication
Featured researches published by Daigorou Kamoto.
Transactions of the Japan Society of Mechanical Engineers. A | 2008
Kuninari Araki; Daigorou Kamoto; Shin-ichi Matsuoka
To comply with energy saving, vacuum insulation panels (VIP) have been used in low temperature application in some years now. And for more high temperature, the material composition and process of VIP were reviewed, the SUS foil was adopted as packaging material, and soluble polyimide was developed as the thermo compression bonding material for high temperature VIP at 150°C. To lower the glass-transition temperature (Tg) under 200°C for the thermo compression bonding (Max230°C), we elaborated the new soluble polyimide using aliphatic diamine copolymer, and controlled Tg to about 176°C. By making from trial VIP and evaluations, it was possible to be maintain high performance concerning coefficient of thermal conductivity : λ<8 [×10-3W/ (m·K)] at 150°C.
Journal of Materials Processing Technology | 2009
Kuninari Araki; Daigorou Kamoto; Shin-ichi Matsuoka
Archive | 1997
Tomoji Oishi; Takao Ishikawa; Daigorou Kamoto; Ken Takahashi; Chikako Yoshioka
Seikei-kakou | 2009
Kuninari Araki; Daigorou Kamoto; Shin-ichi Matsuoka
Seikei-kakou | 2009
Kuninari Araki; Wataru Echigoya; Toshimitsu Tsuruga; Daigorou Kamoto; Shin-ichi Matsuoka
The proceedings of the JSME annual meeting | 2007
Kuninari Araki; Wataru Echigoya; Toshimitsu Tsuruga; Daigorou Kamoto; Shin-ichi Matsuoka
The Proceedings of the Materials and processing conference | 2007
Kuninari Araki; Daigorou Kamoto; Shin-ichi Matsuoka
11th International Workshop on Glasses and Ceramics from Gels (Padova, Italy) | 2001
Tomoji Ohishi; Daigorou Kamoto; Masahiro Nishizawa; Tomoji Oishi
10th International Workshop on Glasses and Ceramics from Gels (Yokohama, Japan) | 1999
Tomoji Ohishi; Takao Ishikawa; Daigorou Kamoto; Tomoji Oishi
Archive | 1997
Takao Ishikawa; Tomoji Ooishi; Daigorou Kamoto; Ken Takahashi; Takuo Kawaguchi; Tetsuo Ishikawa; Yuka Hirota; Noriko Shimasaki
