Daniel I. Amey

A new approach for opto-electronic/MEMS packaging

Opto-electronic and MEMS packages require unique capabilities over and above traditional hermetic multichip modules. In addition to hermeticity or vacuum atmosphere, opto-electronic systems require direct input/output of optical, RF and other sensitive signals through the package using fiber-optic, coaxial and/or other interconnection approaches. Precise optical component alignment and accurate thermal management is critical to achieve component and system performance capabilities. Furthermore, to improve MEMS functionality, performance and service life, a suitable getter and/or dopant is required compatible with the hermetic/vacuum package atmosphere. The getter/dopant is usually activated after achieving hermetic or vacuum atmosphere. A comprehensive MEMS packaging approach is introduced based on photo-patterned thick film metallization, LTCC, brazing technology and new feed-through approaches. The new methodology incorporates most reported MEMS packaging requirements for proven performance, reliability, low cost and mass production capabilities.

High frequency electrical characterization of electronic packaging materials: environmental and process considerations

Recognizing the need for improved materials data to meet the needs of designers of RF and microwave products, DuPont Photopolymers and Electronic Materials (P&EM) has had an ongoing program to generate high frequency data on materials properties (dielectric constant, loss tangent and attenuation). Characterization of ceramic and printed wiring advanced interconnection materials in the 1 to 20 GHz range has been performed for a variety of new Thick Film and Low Temperature Cofired Ceramic (LTCC) dielectrics. Gold and silver conductors applied by both screen printing and photopatterning on these dielectrics as well as on 96% alumina have been tested. These have been benchmarked against Thin Film conductors and copper clad FR-4, Polyimide, BT and Teflon/sup (R)/ printed wiring materials. The performance of many of these systems has been reported for room temperature and humidity conditions. This presentation builds on the previous work with data on the high frequency properties of some of the advanced ceramic and printed wiring materials systems when exposed to 85/spl deg/C temperature and 85% relative humidity. In addition the high frequency performance of a new gold conductor system with both screen printed and photoetched patterning on 96% and 99% Alumina is described demonstrating the improved performance over gold Thin Film metallization typically used in Microwave applications.

Microwave characterization of packaging materials

A major test program to characterize advanced interconnection materials in the 1 to 20 GHz range was initiated. The material systems which were tested include a variety of new Thick Film and Low Temperature Cofired Ceramic (LTCC) dielectrics as well as alumina dielectrics. Gold and silver conductors were applied using conventional screen printing and the new FODELB photopatterning techniques. Thin film conductors on 96% Aluminia and copper clad FR-4, Polyimide, BT and PTFE printed wiring materials were also characterized as benchmarks. The presentation discusses the key attributes of each technology, the test method and data which shows that conventional Thick Film Materials exhibit good uniform properties suitable for applications in the 7+ GHz range and that LTCC Green Tape/sup TM/ and photopatterned FODELB Thick Film materials significantly extend the operating frequency range of ceramic materials exhibiting performance previously only achievable with Thin Film and high performance printed wiring materials.

Electron field emission from Ar + ion-treated thick-film carbon paste

Ion bombardment was used to produce electron-emitting microscale features on surfaces of thick films printed with carbon pastes. This technology can potentially enable the development of large-area field emission displays. Systematic investigations using microscopy and electron field emission experiments have demonstrated a close link among paste formulation, ion processing parameters, and the development of surface microstructures. These investigations were also useful in understanding the fundamentals of microstructure formation under ion bombardment and the field emission characteristics of the carbon-based emitters. Several device concepts aimed toward achieving a low-voltage switchable triode were also tested with varying degrees of success. In this paper, we discuss various technological issues related to the materials, processes, and devices.

Workstation MCM technology comparison with five designs

A ten-chip, high-performance workstation multichip module, implemented in MCM-D technology, was redesigned utilizing three ceramic technologies Fodel/sup (R/), Diffusion Patterning/sup TM/, and low temperature cofired ceramic-and one laminate-based approach. This paper shows the size, speed, thermal performance, and cost impacts of implementing the workstation module in the five different technologies. A detailed explanation of the factors driving module size in each technology is shown: wirebond fanout patterns, trace pitch via density, and substrate to PCB interconnection. Over 100 simulation runs which looked at the performance of critical address, control, and data lines were conducted. A metric for comparing module performance for the workstation module is presented with results for each technology. The cost of each of the five design options is detailed. The paper concludes with a summary of the general applicability of each technology.

MCM-C cost comparison: Fodel(R) vs. Diffusion Patterning/sup TM/ vs. Green Tape/sup TM/

In this paper, the results of a cost model study comparing Diffusion Patterning/sup TM/, Fodel(R), and Green Tape/sup TM/ implementations of a 10 chip Viking SuperSPARC/sup TM/ Module is reviewed. Results include a discussion of key assumptions and a sensitivity analysis performed to determine how assumptions influenced cost for each process. These results identify cost drivers, and suggest opportunities for improving the cost effectiveness of each process.