Daniel N. Koury

Design of Transducer and Package at the Same Time

The early effort of MEMS sensor development was focused mainly on the transducer: designing and manufacturing a mechanical device that could convert a physical input into an electrical signal using traditional semiconductor processes. With the rapid advancement in MEMS technologies, MEMS packaging is becoming increasingly critical and plays a major role in the successful commercialization of a MEMS product. Freescale has adopted the philosophy [1–2] of concurrent transducer and package designs to facilitate the rapid introduction of sensor products into the market. This paper presents a sub-modeling procedure that allows the modeling and simulation of a transducer and a package seamless at the same time.© 2005 ASME

Outrigger: solid outer frame lateral accelerometer design

This paper describes the first solid outer frame lateral MEMS accelerometer designed to reduce both process and in-use stiction. The outrigger lateral accelerometer design connects the individual proof mass capacitive sense array cantilever beam tips to form a stiffened structural outer framework. The outer framework connection design enhancement significantly increases the vertical and lateral beam spring constant of the capacitive array sense fingers. This multi-clamped beam array, demonstrated by the outer frame design enhancement, offers an increase in vertical and lateral stiffness as compared to a singly clamped cantilever beam array comprised of similar dimensions and improved resistance to process and in-use stiction.