Daniel Patrick Chesire

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Featured researches published by Daniel Patrick Chesire.

Archive | 2006

Reinforced bond pad for a semiconductor device

Joze Eura Antol; Philip William Seitzer; Daniel Patrick Chesire; Rafe Carl Mengel; Vance D. Archer; Thomas B. Gans; Taeho Kook; Sailesh Mansinh Merchant

Archive | 2007

Integrated Circuit Device Incorporating Metallurgical Bond to Enhance Thermal Conduction to a Heat Sink

Vance D. Archer; Kouros Azimi; Daniel Patrick Chesire; Warren K Gladden; Seung H. Kang; Taeho Kook; Sailesh Manish Merchant; Vivian Ryan

Archive | 2003

Structure and method for bonding to copper interconnect structures

Mark Adam Bachman; Daniel Patrick Chesire; Sailesh Mansinh Merchant

Archive | 2006

Selective isotropic etch for titanium-based materials

Timothy Scott Campbell; Daniel Patrick Chesire; Kelly Hinckley; Gregory A. Head; Benu B. Patel

Archive | 2006

Structure and method for fabricating flip chip devices

Mark Adam Bachman; Donald Stephen Bitting; Daniel Patrick Chesire; Taeho Kook; Sailesh Mansinh Merchant

Archive | 2006

Routing under bond pad for the replacement of an interconnect layer

Vance D. Archer; Michael C Ayukawa; Mark Adam Bachman; Daniel Patrick Chesire; Seung H. Kang; Taeho Kook; Sailesh Mansinh Merchant; Kurt George Steiner

Archive | 2003