David A. Kaisaki | Researchain

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Featured researches published by David A. Kaisaki.

Archive | 1996

Method of modifying an exposed surface of a semiconductor wafer

Wesley J. Bruxvoort; Scott R. Culler; Kwok-Lun Ho; David A. Kaisaki; Carl R. Kessel; Thomas P. Klun; Heather K. Kranz; Robert P. Messner; Richard J. Webb; Julia P. Williams

Archive | 1998

Method of planarizing the upper surface of a semiconductor wafer

David A. Kaisaki; Heather K. Kranz; Thomas E. Wood; L. Charles Hardy

Archive | 1999

Radiopaque cationically polymerizable compositions comprising a radiopacifying filler, and method for polymerizing same

Kathyrn R. Bretscher; Richard P. Rusin; Bradley D. Craig; Sumita B. Mitra; Joel D. Oxman; Janis R. Gust; Cheryl A Hayne; James W Westberg; Matthew C. Trom; Brant U. Kolb; Dwight W. Jacobs; David A. Kaisaki; James A. Baker

Archive | 1997

Dental visible light curable epoxy system with enhanced depth of cure

David A. Kaisaki; Sumita B. Mitra; William J. Schultz; Robert J. DeVoe

Archive | 1997

Method and article for the production of optical quality surfaces on glass

Craig F. Lamphere; Chong Yong Kim; David A. Kaisaki; Heather K. Kranz; Julia P. Williams

Archive | 1995

Polymeric article having improved hydrophilicity and a method of making the same

Tzu-Li J. Huang; David A. Kaisaki

Archive | 2007

Compositions and methods for modifying a surface suited for semiconductor fabrication

L. Charles Hardy; Heather K. Kranz; Thomas E. Wood; David A. Kaisaki; John J. Gagliardi; John C. Clark; Patricia M. Savu; Philip G. Clark

Archive | 1995

Visible-light curable epoxy system with enhanced depth of cure

David A. Kaisaki; Sumita B. Mitra; William J. Schultz; Robert J. DeVoe

Archive | 1996

Method of modifying a surface of a semiconductor wafer

Wesley J. Bruxvoort; Scott R. Culler; Kwok-Lun Ho; David A. Kaisaki; David A. Kessel; Thomas P. Klun; Heather K. Kranz; Robert P. Messner; Richard J. Webb; Julia P. Williams

Archive | 2008