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Publication
Featured researches published by David E. Schafer.
Journal of the Acoustical Society of America | 2008
Sung B. Lee; David E. Schafer; Peter V. Loeppert
In 2008 it is projected that global demand for mobile devices will reach 1.2 billion units. Compared to electronic gadgets from 2002 when 430 million cell phones were sold world wide, these devices are smaller, have more features, and will generally be priced lower. In order to keep up with designers and manufacturers who relentlessly pursue efficient use of space at lower cost, it is required that component manufacturers pursue the same goal. For a microphone manufacturer like Knowles, this led to the introduction of worlds first commercialized surface‐mountable microphone, the SiSonic™ microphone, in 2002. MEMS technology is used to manufacture the complex miniaturized components used in SiSonic™ microphone. Straightforward miniaturization of microphone diaphragms made of silicon, a common material in MEMS technology, instead of traditional diaphragm materials leads to poor performing microphones. To take advantage of MEMS technology without sacrificing microphone performance we developed the free plate technology. In this presentation we discuss the use of free plate technology to overcome difficulties related to miniaturization in MEMS.
Journal of the Acoustical Society of America | 2002
David E. Schafer; Mekell Jiles; Thomas E. Miller; Stephen C. Thompson
The vibration that is generated by the receiver (loudspeaker) in a hearing aid can be a cause of feedback oscillation. Oscillation can occur if the microphone senses the receiver vibration at sufficient amplitude and appropriate phase. Feedback oscillation from this and other causes is a major problem for those who manufacture, prescribe, and use hearing aids. The receivers normally used in hearing aids are of the balanced armature‐type that has a significant moving mass. The reaction force from this moving mass is the source of the vibration. A modification of the balanced armature transducer has been developed that balances the vibration of its internal parts in a way that significantly reduces the vibration force transmitted outside of the receiver case. This transducer design concept, and some of its early prototype test data will be shown. The data indicate that it should be possible to manufacture transducers that generate less vibration than equivalent present models by 15–30 dB.
Journal of the Acoustical Society of America | 2003
Peter V. Loeppert; David E. Schafer
Journal of the Acoustical Society of America | 2008
Stephen C. Thompson; David E. Schafer; Daniel M. Warren
Journal of the Acoustical Society of America | 2007
David E. Schafer; Mekell Jiles
Archive | 2010
Thomas E. Miller; Clifford Ryan Grounds; Henry G Nepomuceno; David E. Schafer; George Patterson
Journal of the Acoustical Society of America | 2009
Daniel M. Warren; Stephen C. Thompson; David E. Schafer
Archive | 2006
Mekell Jiles; David E. Schafer; Anthony D. Minervini; Hanny Sunarto; Thomas E. Miller; Daniel M. Warren
Archive | 2004
Thomas E. Miller; David E. Schafer
Archive | 2003
Mekell Jiles; David E. Schafer